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Rogers DiClad 870 Microwave PCB 31mil 93mil 125mil Woven Fiberglass Reinforced PTFE-based laminate

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

Rogers DiClad 870 PCBs are woven fiberglass/PTFE composite materials specifically designed for use as printed circuit board (PCB) substrates, making them well-suited for applications requiring reliable RF and microwave performance. A key advantage of these laminates lies in their woven fiberglass reinforcement: when compared to nonwoven fiberglass-reinforced PTFE-based laminates with similar dielectric constants, DiClad 870 delivers significantly greater dimensional stability—an essential property for maintaining PCB structural integrity during manufacturing and long-term use.

 

What further distinguishes DiClad 870 from other laminates in the DiClad series is its optimized material composition. By utilizing fewer plies of woven fiberglass and a higher proportion of PTFE content, this laminate achieves lower dielectric constants (Dk) and dissipation factors (Df) while maintaining a thickness comparable to other DiClad products. These characteristics make it a preferred choice for PCB designs where signal loss minimization and high-frequency performance are critical.

 

 

 

Features & Benefits

  1. Dielectric constant of 2.33 at 10GHz and 1 MHz
  2. Dissipation factor of .0013 at 10GHz
  3. Lowest moisture absorption among PTFE based composites
  4. Stable Dk over a wide frequency range ensuring easy design transition and scalability of design
  5. Low Dk supports wider line widths for lower insertion loss
  6. Copper matched CTE in X and Y axis
  7. Excellent outgassing value in TML, CVCM and WVR.
  8. Meets requirements of UL94-V0

Our PCB Capability (DiClad 870)

PCB Capability (DiClad 870)

PCB material:

Woven Fiberglass reinforced PTFE Laminates

Designation:

DiClad 870

Dielectric constant:

2.33

Layer count:

Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB

Dielectric thickness:

31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm)

Copper weight:

1oz (35µm), 2oz (70µm)

 

 

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Red, Yellow etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc..

Typical Applications

1. Commercial Phased Array Networks

2. Digital Radio Antennas

3. Filters, Couplers, LNAs

4. Guidance Systems

5. Low Loss Base Station Antennas

6. Radar Feed Networks

 

 

 

 

Our Advantages

  1. Wide ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi etc.
  2. 16000workshop; 30000output capability per month; 8000 types of PCB's per month;
  3. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
  4. Quick CADCAM checking and free PCB quotation;
  5. More than 20+ years of high frequency PCB experience;
  6. Diversified shipping method: FedEx, DHL, TNT, EMS;
  7. No MOQ, low cost for prototypes and small runs quantity;
  8. Delivery on time: >98% ; Customer complaint rate: <1%

 

Appendix: Data sheet of DiClad 870

 

PCB Electrical Properties Tables
Click to expand/collapse the table
Property DiClad 870 Condition Test Method
Electrical Properties
Dielectric Constant @ 10 GHz 2.33 C23/50 IPC TM-650 2.5.5.5
Dielectric Constant @ 1 MHz 2.33 C23/50 IPC TM-650 2.5.5.3
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 1 MHz 0.0009 C23/50 IPC TM-650 2.5.5.3
Thermal Coefficient of Er (ppm/°C) -161 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Volume Resistivity (MΩ-cm) 1.5 x 10 9 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 3.4 x 10 7 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance >180 D48/50 ASTM D-495
Dielectric Breakdown (kV) >45 D48/50 ASTM D-149
Mechanical Properties
Peel Strength (lbs.per inch) 14 After Thermal Stress IPC TM-650 2.4.8
Tensile Modulus (kpsi) 485(MD), 346(CD) A, 23°C ASTM D-638
Tensile Strength (kpsi) 14.9(MD), 11.2 (CD) A, 23°C ASTM D-882
Compressive Modulus (kpsi) 327 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 437 A, 23°C ASTM D-790
Thermal Properties
Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis 17 29 217 0°C to 100°C IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer
Thermal Conductivity (W/mK) 0.257 100°C ASTM E-1225
Flammability UL Meets requirements of UL94-V0 C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10
Physical Properties
Density (g/cm3) 2.26 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.02 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) 0.02 0.00 0.01 NO 125°C, ≤ 10-6 torr NASA SP-R-0022A Maximum 1.00% Maximum 0.10%