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Rogers DiClad 870 Microwave PCB 31mil 93mil 125mil Woven Fiberglass Reinforced PTFE-based laminate
Rogers DiClad 870 Microwave PCB 31mil 93mil 125mil Woven Fiberglass Reinforced PTFE-based laminate
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
General Description
Rogers DiClad 870 PCBs are woven fiberglass/PTFE composite materials specifically designed for use as printed circuit board (PCB) substrates, making them well-suited for applications requiring reliable RF and microwave performance. A key advantage of these laminates lies in their woven fiberglass reinforcement: when compared to nonwoven fiberglass-reinforced PTFE-based laminates with similar dielectric constants, DiClad 870 delivers significantly greater dimensional stability—an essential property for maintaining PCB structural integrity during manufacturing and long-term use.
What further distinguishes DiClad 870 from other laminates in the DiClad series is its optimized material composition. By utilizing fewer plies of woven fiberglass and a higher proportion of PTFE content, this laminate achieves lower dielectric constants (Dk) and dissipation factors (Df) while maintaining a thickness comparable to other DiClad products. These characteristics make it a preferred choice for PCB designs where signal loss minimization and high-frequency performance are critical.
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Features & Benefits
- Dielectric constant of 2.33 at 10GHz and 1 MHz
- Dissipation factor of .0013 at 10GHz
- Lowest moisture absorption among PTFE based composites
- Stable Dk over a wide frequency range ensuring easy design transition and scalability of design
- Low Dk supports wider line widths for lower insertion loss
- Copper matched CTE in X and Y axis
- Excellent outgassing value in TML, CVCM and WVR.
- Meets requirements of UL94-V0
Our PCB Capability (DiClad 870)
PCB Capability (DiClad 870) |
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PCB material: |
Woven Fiberglass reinforced PTFE Laminates |
Designation: |
DiClad 870 |
Dielectric constant: |
2.33 |
Layer count: |
Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
Dielectric thickness: |
31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
Copper weight: |
1oz (35µm), 2oz (70µm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Red, Yellow etc. |
Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc.. |
Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Guidance Systems
5. Low Loss Base Station Antennas
6. Radar Feed Networks

Our Advantages
- Wide ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi etc.
- 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;
- ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
- Quick CADCAM checking and free PCB quotation;
- More than 20+ years of high frequency PCB experience;
- Diversified shipping method: FedEx, DHL, TNT, EMS;
- No MOQ, low cost for prototypes and small runs quantity;
- Delivery on time: >98% ; Customer complaint rate: <1%
Appendix: Data sheet of DiClad 870
| Property | DiClad 870 | Condition | Test Method |
| Electrical Properties | |||
| Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
| Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Er (ppm/°C) | -161 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 3.4 x 10 7 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance | >180 | D48/50 | ASTM D-495 |
| Dielectric Breakdown (kV) | >45 | D48/50 | ASTM D-149 |
| Mechanical Properties | |||
| Peel Strength (lbs.per inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
| Tensile Modulus (kpsi) | 485(MD), 346(CD) | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 14.9(MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 327 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 437 | A, 23°C | ASTM D-790 |
| Thermal Properties | |||
| Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis | 17 29 217 | 0°C to 100°C | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
| Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
| Flammability UL | Meets requirements of UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
| Physical Properties | |||
| Density (g/cm3) | 2.26 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.02 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 0.00 0.01 NO | 125°C, ≤ 10-6 torr | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |

