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Rogers DiClad 527 PCB: Stable Dk and Low Loss 0.0018 for Radar and Base Station Antennas

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

Rogers DiClad 527 PCBs are fiberglass-woven reinforced composite materials, specifically engineered to serve as substrates for printed circuit boards.

 

Compared to pure PTFE-based materials, DiClad 527 laminates feature a higher proportion of fiberglass reinforcement relative to PTFE content. This precisely balanced composition not only enables a broader range of adjustable dielectric constant (Dk) values but also enhances two critical performance attributes: superior dimensional stability and more accurate registration during PCB manufacturing.

 

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)

18" x 24" (457 x 610mm)

 

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"

0.030" (0.762mm) with a tolerance of +/- 0.0020"

0.060" (1.524mm) with a tolerance of +/- 0.0020"

 

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil

1/2 oz. (18µm)

1 oz. (35µm)

 

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.

 

Key Features:

  1. Dk range: 2.40 to 2.60
  2. Low dissipation factor: .0018 at 10GHz
  3. Low moisture absorption

 

Key Benefits:

  1. Stable Dk across a wide frequency range
  2. Low circuit losses at high frequencies
  3. Minimal performance variation in high humidity environments
  4. Excellent dimensional stability
  5. Consistent product performance
  6. Uniform electrical properties across frequencies
  7. Reliable mechanical performance
  8. Excellent chemical resistance

 

 

Our PCB Capability (DiClad 527)

PCB Capability (DiClad 527)

PCB Material:

Woven Fiberglass/PTFE composite

Designation:

DiClad 527

Dielectric constant:

2.40-2.60 10GHz/23˚C

Dissipation factor

0.0017 10GHz/23˚C

Layer count:

Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness

20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

Typical Applications:

  1. Radar feed networks
  2. Commercial phased array networks
  3. Low-loss base station antennas
  4. Guidance systems
  5. Digital radio antennas
  6. Filters, couplers, and LNAs

 

DiClad 527 Data Sheet

PCB Electrical Properties Tables
Click to expand/collapse the table
Typical Value
Properties DiClad 527 Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Dissapation Factor 0.0017 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissapation Factor 0.0010 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric
Constant
-153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 1.2 x 109 MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.5 x 107 C96/35/90 - IPC TM-650 2.5.17.1
Dielectric Breakdown >45 kV D48/50 - ASTM D-149
Arc Resistance
>180 - - ASTM D-495
Thermal Properties
Coefficient of Thermal Expansion - x 14 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 21 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 173 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity
0.26 W/(m.K) ASTM E1461
Mechanical Properties
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH - ASTM D-638
Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH - ASTM D-882
Compressive Modulus 359 kpsi 23˚C @ 50% RH - ASTM D-695
Flex Modulus
537 kpsi 23˚C @ 50% RH ASTM D-3039
Physical Properties
Flammability V-0 C48/23/50 &
C168/70
UL 94
Moisture Absorption 0.03 0 E1/105+D24/23 IPC TM-650 2.6.2.2
Density 231 g/cm³ C24/23/50 Method A ASTM D792
NASA
Outgassing
Total Mass Lost 0.02 0 125°C, ≤ 10-6 torr NASA SP-R-0022A
Collected Volatiles 0.00 0
Water Vapor Recovered 0.01 0