Home
-
Rogers PCB
-
Rogers DiClad 527 PCB: Stable Dk and Low Loss 0.0018 for Radar and Base Station Antennas
Rogers DiClad 527 PCB: Stable Dk and Low Loss 0.0018 for Radar and Base Station Antennas
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
General Description
Rogers DiClad 527 PCBs are fiberglass-woven reinforced composite materials, specifically engineered to serve as substrates for printed circuit boards.
Compared to pure PTFE-based materials, DiClad 527 laminates feature a higher proportion of fiberglass reinforcement relative to PTFE content. This precisely balanced composition not only enables a broader range of adjustable dielectric constant (Dk) values but also enhances two critical performance attributes: superior dimensional stability and more accurate registration during PCB manufacturing.
Standard Panel Sizes for DiClad 527:
18" x 12" (457 x 305mm)
18" x 24" (457 x 610mm)
Standard Thicknesses for DiClad 527:
0.020" (0.508mm) with a tolerance of +/- 0.0020"
0.030" (0.762mm) with a tolerance of +/- 0.0020"
0.060" (1.524mm) with a tolerance of +/- 0.0020"
Standard Claddings for DiClad 527:
Electrodeposited Copper Foil
1/2 oz. (18µm)
1 oz. (35µm)
For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.
Key Features:
- Dk range: 2.40 to 2.60
- Low dissipation factor: .0018 at 10GHz
- Low moisture absorption
Key Benefits:
- Stable Dk across a wide frequency range
- Low circuit losses at high frequencies
- Minimal performance variation in high humidity environments
- Excellent dimensional stability
- Consistent product performance
- Uniform electrical properties across frequencies
- Reliable mechanical performance
- Excellent chemical resistance

Our PCB Capability (DiClad 527)
PCB Capability (DiClad 527) |
|
PCB Material: |
Woven Fiberglass/PTFE composite |
Designation: |
DiClad 527 |
Dielectric constant: |
2.40-2.60 10GHz/23˚C |
Dissipation factor |
0.0017 10GHz/23˚C |
Layer count: |
Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness |
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications:
- Radar feed networks
- Commercial phased array networks
- Low-loss base station antennas
- Guidance systems
- Digital radio antennas
- Filters, couplers, and LNAs
DiClad 527 Data Sheet
| Typical Value | |||||||
| Properties | DiClad 527 | Units | Test Conditions | Test Method | |||
| Electrical Properties | |||||||
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | ||
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | ||
| Dissapation Factor | 0.0017 | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |||
| Dissapation Factor | 0.0010 | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | |||
| Thermal Coefficient of Dielectric Constant |
-153 | ppm/˚C | -10 to 140˚C | 10 GHz | IPC TM-650 2.5.5.5 | ||
| Volume Resistivity | 1.2 x 109 | MΩ-cm | C96/35/90 | - | IPC TM-650 2.5.17.1 | ||
| Surface Resistivity | 4.5 x 107 | MΩ | C96/35/90 | - | IPC TM-650 2.5.17.1 | ||
| Dielectric Breakdown | >45 | kV | D48/50 | - | ASTM D-149 | ||
| Arc Resistance |
>180 | - | - | ASTM D-495 | |||
| Thermal Properties | |||||||
| Coefficient of Thermal Expansion - x | 14 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | ||
| Coefficient of Thermal Expansion - y | 21 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | ||
| Coefficient of Thermal Expansion - z | 173 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.24 | ||
| Thermal Conductivity |
0.26 | W/(m.K) | ASTM E1461 | ||||
| Mechanical Properties | |||||||
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 | ||
| Young’s Modulus | 517, 706 | kpsi | 23˚C @ 50% RH | - | ASTM D-638 | ||
| Tensile Strength (MD, CMD) | 19.0, 15.0 | kpsi | 23˚C @ 50% RH | - | ASTM D-882 | ||
| Compressive Modulus | 359 | kpsi | 23˚C @ 50% RH | - | ASTM D-695 | ||
| Flex Modulus |
537 | kpsi | 23˚C @ 50% RH | ASTM D-3039 | |||
| Physical Properties | |||||||
| Flammability | V-0 | C48/23/50 & C168/70 |
UL 94 | ||||
| Moisture Absorption | 0.03 | 0 | E1/105+D24/23 | IPC TM-650 2.6.2.2 | |||
| Density | 231 | g/cm³ | C24/23/50 | Method A | ASTM D792 | ||
| NASA Outgassing |
Total Mass Lost | 0.02 | 0 | 125°C, ≤ 10-6 torr | NASA SP-R-0022A | ||
| Collected Volatiles | 0.00 | 0 | |||||
| Water Vapor Recovered | 0.01 | 0 | |||||

