TLY-5Z High Frequency PCB Material Introduction Greetings, I'm Jane, the regional sales manager for Bicheng PCB. Our topic for discussion today is Taconic TLY-5Z PCBs, which are a type of high frequency PCB manufactured on lightweight substrates. TLY-5Z laminates are advanced glass-filled PTFE composites reinforced with woven fiberglass. The glass-filled structure was created for low density applications with low weight constraints, such as aerospace. This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites. This produces a dimensionally stable composite, which would not be achievable with non-reinforced PTFEs. The low density technique also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites. TLY-5Z Typical Properties TLY-5Z laminates exhibit a low dielectric constant and low dissipation factor of 2.2 and 0.0015 respectively at 10 GHz. They also have good volume resistivity and surface resistivity, with values of 10^9 Mohms/cm and 10^8 Mohms respectively. Additionally, TLY-5Z has a high dielectric breakdown voltage of 45 kV and a dielectric strength of 770 V/mil. Compared to conventional 2.2 dielectric constant materials, TLY-5Z PCB has a lower temperature coefficient of dielectric constant (TCDk) of -72 ppm/°C, ranging from -55 to 150°C. However, its thermal conductivity is relatively low at 0.2 W/m/K. On the other hand, the coefficient of thermal expansion is pretty good. TLY-5Z has half the thermal expansion of PTFE-rich substrates, which allows for improved drilling and thermal cycling. It has 30 and 40 ppm/oC in the X and Y directions, and 130 ppm/oC in the Z-axis. TLY-5Z laminates have excellent mechanical properties. They exhibit a peel strength of 7 lbs./inch for 1 oz copper and a tensile strength of over 9000 psi in both MD and CD directions. Tensile modulus in both directions exceeds 16000 psi, and they can elongate extension by 6% and 6.9%. When it comes to flexural strength, TLY-5Z performs well, with 10300 psi and 11600 psi in the MD and CD directions respectively. Additionally, the flexural modulus is very high, with values topping 300 thousand and 400 thousand in the MD and CD directions respectively. Taconic TLY-5Z PCB has a negative dimensional stability nominal value of approximately -0.05% on 10 mils and 30 mils thicknesses evaluated after bake in the MD direction. When tested after thermal stress, it tends to express slightly more in the negative direction, with the value being -0.07% on both thicknesses. TLY-5Z is a low-density laminate, with a density of 1.92 g/cm3. It has a specific heat value of 0.95 J/g/℃ and a low moisture absorption rate of 0.03%. Finally, TLY-5Z has a Durometer hardness of 68 and is UL 94V-0 compatible. Property Conditions Value Unit Test Method Electrical properties Dielectric Constant @ 10 GHz 2.20+/- 0.04 IPC-650 2.5.5.5.1 Mod. Dissipation Factor @ 10 GHz 0.0015 IPC-650 2.5.5.5.1 Mod. Volume Resistivity 10^9 Mohms/cm IPC-650 2.5.17.1 Surface Resistivity 10^8 Mohms IPC-650 2.5.17.1 Dielectric Breakdown Voltage 45 kV IPC-650 2.5.6 Dielectric Strength 770 V/mil IPC-650 2.5.6.2 Thermal properties Tc(D)K (-55 ~150°C) -72 ppm/°C IPC-650 2.5.5.6 Mod. Thermal Conductivity 0.2 W/M*K IPC-650 2.4.50 CTE (25 - 260°C) X 30 ppm/ºC IPC-650 2.4.41 Y 40 ppm/ºC IPC-650 2.4.41 Z 130 ppm/ºC IPC-650 2.4.41 Mechanical Properties Peel Strength 1 oz. copper 7 lbs./inch IPC-650 2.4.8 Tensile Strength MD 9137 psi IPC-650 2.4.18.3 CD 9572 psi IPC-650 2.4.18.3 Tensile Modulus MD 182,748 psi IPC-650 2.4.18.3 CD 165,344 psi IPC-650 2.4.18.3 Mechanical Properties Elongation MD 6 % IPC-650 2.4.18.3 CD 6.9 % IPC-650 2.4.18.3 Flex Strength MD 10,300 psi ASTM D790 CD 11,600 psi ASTM D790 Flex Modulus MD 377,100 psi ASTM D790 CD 432,213 psi ASTM D790 Dimensional Stability MD -0.05, -0.05 % (10mil, 30mil) IPC-650 2.4.39 (Bake) CD -0.17,-0.11 % (10mil, 30mil) IPC-650 2.4.39 (Bake) Dimensional Stability MD -0.07, -0.07 % (10mil, 30mil) IPC-650 2.4.39 (Stress) CD -0.22, -0.14 % (10mil, 30mil) IPC-650 2.4.39 (Stress) Density Specific Gravity 1.92 g/cm3 IPC-650 2.3.5 Chemical / Physical Properties Specific Heat 0.95 J/g°C IPC-650 2.4.50 Moisture Absorption 0.03 % IPC-650 2.6.2.1 Hardness Durometer 68 - ASTM D2240 UL-94 Flammability Rating V-0 UL-94 Our PCB Capability (TLY-5Z) For TLY-5Z PCB, we can provide you with double layer board, multi-layer board and hybrid designs. The standard thickness such as 10 mils, 20 mils, 30 mils, 60mils etc are available in house. TLY-5Z can be custom-manufactured in increments of 10 mils (0.250mm). Finished copper on track lines can be done with 1oz and 2oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel. Solder mask of green, black, blue, yellow and red is available in house. Surface pads plating includes immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, ENEPIG and bare copper etc. PCB Material: Glass-filled PTFE composites with Woven Fiberglass Reinforcement. Designation: TLY-5Z Dielectric Constant: 2.20 +/- 0.04 (10 GHz) Dissipation Factor 0.0015 (10 GHz) Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB Laminate Thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) Copper Weight: 1oz (35 µm), 2oz (70µm) PCB Size: ≤400mm X 500mm Solder Mask: Green, Black, Blue, Yellow, Red etc. Surface Finish: Immersion gold, Hot air soldering level (HASL), Immersion silver, Immersion tin, OSP, Pure gold plated, ENEPIG, Bare copper, etc.. A Piece of TLY-5Z PCB A type of 60mil TLY-5Z printed circuit board with immersion silver for combiners is now displayed on the screen. These boards can also be found in the applications of aerospace components, low weight antennas for aircraft and RF passive components etc. Conclusion TLY-5Z is also an attractive choice from a cost perspective. In comparison to traditional PTFE-rich copper clad laminates, the glass-filled structure offers a more cost-effective alternative. TLY-5Z PCB can be employed in high-volume commercial microwave applications when PTFE-rich substrates are too expensive. OK. This concludes today’s episode. Thank you for reading. See you next time.
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