Rogers CuClad 250 High Frequency PCB Material Introduction As advanced woven fiberglass/PTFE composites, CuClad® Laminates deliver tailored electrical properties through controlled material composition, enabling optimal performance from ultra-low loss circuits to structurally stable designs. The consistent quality and woven structure of CuClad® Laminates ensure exceptional dimensional stability and uniform dielectric properties, outperforming standard non-woven materials. This reliability positions CuClad® Laminates as the preferred substrate for demanding RF applications. Furthermore, the exclusive cross-ply geometry of CuClad® Laminates offers unparalleled isotropy, granting equal electrical and mechanical characteristics in all planar directions. This unique advantage makes CuClad® Laminates indispensable for cutting-edge technologies, including sophisticated phased array antenna systems. Rogers CuClad 250 laminate incorporates a higher fiberglass-to-PTFE ratio, providing dielectric constants ranging from Er=2.40 to 2.60. This design prioritizes outstanding mechanical properties that closely approach those of conventional FR-4 substrates, while maintaining the benefits of a PTFE-based system. Key advantages include superior dimensional stability and lower coefficient of thermal expansion (CTE) in all planar directions, making CuClad 250 laminate exceptionally suitable for multilayer boards, large-format arrays, and applications where mechanical reliability under thermal stress is as important as electrical performance. Features & Benefits Cross Plied Woven Fiberglass, alternating plies are oriented 90o to each other High PTFE to Glass Ratio Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates Electrical and Mechanical Isotropy in theX-Y Plane Extremely Low Loss Well Suited for Er Sensitive Circuits Data Sheet Typical Properties: CuClad Property Test Method Condition CuClad 217 CuClad 233 Cuclad 250 Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20 2.33 2.40 to 2.55 Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20 2.33 2.40 to 2.60 Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009 0.0013 0.0017 Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -160 -161 -153 Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14 14 14 Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 2.3 x 10 8 8.0 x 10 8 8.0 x 10 9 Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4 x 10 6 2.4 x 10 6 1.5 x 10 8 Arc Resistance (seconds) ASTM D-495 D48/50 >180 >180 >180 Tensile Modulus (kpsi) ASTM D-638 A, 23°C 275, 219 510, 414 725, 572 Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6 10.3, 9.8 26.0, 20.5 Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237 276 342 Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357 371 456 Dielectric Breakdown (kv) ASTM D-149 D48/50 > 45 > 45 > 45 Specific Gravity (g/cm3) ASTM D-792 Method A A, 23°C 2.23 2.26 2.31 Water Absorption (%) MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02 0.02 0.03 Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer 0°C to 100°C 29 28 246 23 24 194 18 19 177 Thermal Conductivity ASTM E-1225 100°C 0.26 0.26 0.25 Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) NASA SP-R-0022A Maximum 1.00% Maximum 0.10% 125°C, ≤ 10-6 torr 0.01 0.01 0.00 NO 0.01 0.01 0.00 NO 0.01 0.00 0.00 NO Flammability UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0 Meets requirements of UL94-V0 Meets requirements of UL94-V0 Our PCB Capability ( CuClad ) Rogers CuClad 250 PCBs are available with standard electrodeposited copper cladding of ½ oz, 1 oz, or 2 oz on both sides, with options for other copper weights and rolled copper foil upon request. Rogers CuClad 250 laminates can also be supplied bonded to a heavy‑metal ground plane using aluminum, brass, or copper plates, which serve as an integral heat sink while providing enhanced mechanical support to the substrate. When placing an order for CuClad products, please specify key parameters such as the dielectric constant, thickness, copper cladding type and weight, panel size, and any other special requirements. Standard panel sizes include 36” x 36” in a cross‑plied configuration and 36” x 48” in a parallel‑plied configuration. For custom sizes or technical assistance, our engineering team is ready to support your project needs. A PCB and Typical Applications Rogers CuClad 250 PCB addresses the complex requirements of modern high-reliability applications in defense, aerospace, and telecommunications. Its controlled dielectric properties and enhanced mechanical strength make it an ideal substrate for military electronic systems (radar, ECM, ESM), telecommunication networks, and critical microwave/RF components such as LNAs, filters, and couplers. In environments where performance cannot be compromised, CuClad 250 PCB ensures unwavering signal integrity, thermal endurance, and operational consistency—forming the dependable material backbone for systems where mission success depends on every detail.
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