Our Advantages
Our factories are certified to ISO9001, ISO14001, IATF16949, and UL standards, ensuring top-tier quality and compliance. Through proactive engineering design, we address potential issues in pre-production to minimize risks. We offer one-stop PCB solutions, including prototypes, medium-sized batches, multi-layer boards, HDI, high-frequency/high-speed designs, and flexible-rigid boards. Rigorous quality controls—such as AOI, high-voltage testing, impedance control, solderability checks, thermal stress tests, ionic contamination analysis, and reliability testing—guarantee superior performance. With over 20 years of PCB expertise, we maintain an on-time delivery rate of >98% and a customer complaint rate of < 1% , reflecting our commitment to excellence and reliability.
Material Expertise
As a strategic partner of leading material innovators such as Rogers, Taconic, and Wangling, we maintain full compatibility with over 200 specialized substrates, covering a wide range of dielectric constants (2.2–25). Our material portfolio includes:
Rogers: 3000 series, 4000 series, 5000 series, 6000 series, TMM series, DiClad series, CuClad series
Taconic: TLX series, TLY series, RF series
Wangling: DK series (2.2–25), F4BM, F4BME, F4BTM, F4BTME, F4BTMS, TF, TP, WL-CT, TFA series
Extended Product Portfolio:
FR-4 PCBs: Standard to advanced multilayer designs for industrial and consumer electronics.
Metal Core PCBs (MCPCB): Optimized for LED lighting, power converters, and thermal management.
Flexible & Rigid-Flex PCBs: Lightweight, durable circuits for wearables, medical devices, and automotive systems.
HDI & Heavy Copper PCBs: High-density interconnects for miniaturized devices and high-power applications .
Advanced PCB Manufacturing Capabilities
Full-Scale Production Flexibility
Supports prototyping to volume manufacturing, covering:
Up to 50-layer HDI designs (standard production: 1-32 layers)
Hybrid material stacks & metal-clad edge board structures
Ultra-thin substrates (0.1mm–12mm) and heavy copper designs (30 oz)
Precision Process Control
Impedance tolerance ±5% (±10% customizable)
Ceramic substrates optimized for 5G/mmWave thermal management
Laser drilling / blind & buried vias / sequential lamination HDI processes
Comprehensive Surface Finishes
ENIG/ENEPIG/Immersion Tin/Immersion Silver/OSP/Carbon Ink
Lead-free HASL/Gold Fingers/Peelable Solder Mask +20+ techniques
High-Reliability Applications
Delivers end-to-end solutions for wireless communications, aerospace, and smart industrial systems through material diversity, process precision, and scalable manufacturing.
Rigorous Quality Control
Supplier Qualification & Design Verification
Shenzhen Bicheng Electronics initiates quality control through rigorous supplier evaluation aligned with ISO9001/14001 standards, coupled with pre-order contract capability assessments. Manufacturing data undergoes dual-verification via CAM file conversion and joint engineer sign-off on MI documents, ensuring design specifications are fully translated into production requirements.
Material Inspection & In-Process Control
Advanced incoming material checks enforce 100% dielectric property validation (Dk/Df testing via spectrometer) and copper purity verification (≥99.9%), integrated with shelf-life tracking systems. Production processes feature real-time monitoring of MI documentation, equipment, and WIP, enhanced by automated AOI after every lamination cycle (0.1mm defect detection) and ultrasonic testing to prevent delamination.
Final Validation & Reliability Assurance
Every PCB completes 100% electrical testing and comprehensive visual inspection. Reliability is further verified through high-potential (Hi-Pot) testing, thermal cycling/thermal stress simulations, and ionic contamination analysis, ensuring robustness under extreme operating conditions.
Delivery & Continuous Improvement
Pre-shipment protocols include FQA statistical sampling audits and 100% shipping detail verification. A dedicated customer service team enables real-time feedback resolution, closing the loop from raw materials to after-sales support for end-to-end quality governance.
Tailored Customer-Centric Services
We deliver comprehensive end-to-end support through engineering collaboration (DFM reviews & impedance calculations for design optimization), specialized low-volume/high-mix solutions for niche/evolving projects, and reliable global logistics with DDU terms for streamlined international fulfillment.
At Bicheng Electronics Technology Co., Ltd, We integrate cutting-edge technical expertise with rapid-response production and rigorous quality control to deliver PCB solutions that consistently exceed specifications. Partner with us to bring your designs to life with high-performance and reliability！