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TU-768 High-Tg and High Thermal Reliability PCB Board for Consumer Electronics and Automotiv
TU-768 High-Tg and High Thermal Reliability PCB Board for Consumer Electronics and Automotive
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Brief Introduction
TU-768 and TU-768P laminate and prepreg are constructed from high-quality woven E-glass reinforced with an advanced epoxy resin system. This formulation provides inherent UV-blocking characteristics, ensuring compatibility with automated optical inspection (AOI) processes for improved manufacturing efficiency and reliability.
These materials are specifically engineered for printed circuit boards requiring exceptional durability, capable of withstanding severe thermal cycling and extensive assembly operations. TU-768 laminates deliver superior performance with excellent Coefficient of Thermal Expansion (CTE) control, outstanding chemical resistance, proven thermal stability, and robust Conductive Anodic Filamentation (CAF) resistance for enhanced long-term reliability.
Main Applications
Consumer Electronics
Server, workstation
Automotive
Key Features
Lead Free process compatible
Excellent coefficient of thermal expansion
Anti-CAF property
Superior chemical and thermal resistance
Fluorescence for AOI
Moisture resistance
Our PCB Capability (TU-768)
| Our PCB Capability (TU-768) | |
| PCB Material: | High-Tg and High Thermal Reliability Epoxy Resin |
| Designation: | TU-768 |
| Dielectric constant: | 4.3 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Typical Properties of TU-768
| Typical Properties for TU-768 Laminate | |||
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 190°C | ||
| Tg (DSC) | 180°C | > 170°C | |
| Tg (TMA) | 170°C | E-2/105 | |
| Td (TGA) | 350°C | > 340°C | |
| CTE x-axis | 11~15 ppm/°C | N/A | |
| CTE y-axis | 11~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.70% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | > 60 min | > 30 min | |
| T288 | > 20 min | E-2/105 | > 15 min |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 4.3 | ||
| Loss Tangent (RC 50%) @10GHz | 0.018 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 4.4 / 4.3 | < 5.2 | |
| 5GHz (SPC method) | 4.3 | E-2/105 | N/A |
| 10GHz (SPC method) | 4.3 | N/A | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.019 /0.018 | < 0.035 | |
| 5GHz (SPC method) | 0.021 | E-2/105 | N/A |
| 10GHz (SPC method) | 0.023 | N/A | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 kV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 25 GPa | A | N/A |
| Fill Direction | 22 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 7~9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105+D-24/23 | < 0.8 % |