Home - Microwave PCB - TF1020 High DK10.2 PCB 25mil Thickness Double Sided Copper Immersion Gold PCB for Microwave and Millimeter-Wave Applications

TF1020 High DK10.2 PCB 25mil Thickness Double Sided Copper Immersion Gold PCB for Microwave and Millimeter-Wave Applications

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Brief Introduction

 This TF1020 high-frequency PCB is a double-sided circuit board designed for demanding microwave and millimeter-wave applications. Featuring a 0.635mm (25mil) TF1020 core material with high dielectric constant (10.2), TF1020 PCB board measures 105mm × 72mm in a single-up panel configuration. The TF1020 PCB construction utilizes 1oz copper layers on both top and bottom surfaces, starting from 0.5oz base copper, and is finished with immersion gold surface treatment and black solder mask on the top layer. TF1020 circuit board exclusively supports surface-mount components, making it ideal for high-frequency designs requiring consistent electrical performance.

 

Here are more specific detail in table below.

 

PCB Specifications

Scrollable PCB Table
Click to expand/collapse the table
TF1020 High Frequency PCB 25mil Double Sided Alternative High DK 10.2 Substrates With Immersion Gold
PCB SIZE 105 x 72mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(0.5 oz+plate) TOP layer
TF1020 - 0.635mm
copper ------- 35um(0.5 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space: 10 mil / 12 mil
Minimum / Maximum Holes: 0.4 mm / 3.2 mm
Number of Different Holes: 6
Number of Drill Holes: 18
Number of Milled Slots: 1
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: TF1020 DK 10.2
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.7 mm ±0.1
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: Top layer
Solder Mask Color: Black
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059""
Board plating: 0.0029""
Drill tolerance: 0.002""
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

TF Series High Frequency Laminates

The TF series laminates represent advanced composite materials combining microwave-grade PTFE resin with ceramic fillers, specifically engineered without fiberglass cloth reinforcement. This unique TF material formulation allows precise dielectric constant control through careful adjustment of the ceramic-to-PTFE ratio. TF1020 PCB demonstrates exceptional dielectric properties and reliability through specialized manufacturing processes. The product line includes TF (base material without copper cladding), TF-1 (single-sided copper cladding), and TF-2 (double-sided copper cladding) variants, providing design flexibility for various high-frequency applications including millimeter-wave radar sensors, antenna systems, transceivers, modulators, multiplexers, power supply equipment, and automated control systems.

 

Our PCB Capability (TF series)

PCB Capability (TF Series)

PCB Material:

Polyphenylene ether, ceramic

Designation                            (TF Series)

Designation

DK

DF

 

TF300

3.0±0.06

0.0010

 

TF440

4.4±0.09

0.0010

 

TF600

6.0±0.12

0.0010

 

TF615

6.15±0.12

0.0010

 

TF920

9.2±0.18

0.0010

 

TF960

9.6±0.19

0.0012

 

TF1020

10.2±0.2

0.0012

 

TF1600

16.0±0.4

0.0014

Layer count:

Single Sided, Double Sided PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness    (Dielectric thickness    or overall thickness)

0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm

PCB size:

≤240mm X 240mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

TF Data Sheet

 

Click to expand/collapse the table
Product Technical Parameter Product Models & Data Sheet
Product Features Test Conditions Unit TF TF-1 TF-2
Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz.
When the dielectric constant is >11, the test condition is 5GHz.
/ 3.0±0.06 4.4±0.09
6.0±0.12 6.15±0.12
9.2±0.18 9.6±0.19
10.2±0.2 16.0±0.4
The dielectric constant can be customized within the range of 3.0~16
Tolerance of Dielectric Constant Dielectric Constant 3.0~11.0 / ±2%
Dielectric Constant 11.1~16.0 / ±2.5%
Loss Tangent Dielectric Constant 3.0~9.5 10GHz / 0.0010
Dielectric Constant 9.6~11.0 10GHz / 0.0012
Dielectric Constant 11.1~16.0 5GHz / 0.0014
Dielectric Constant Temperature Coefficient Dielectric Constant 3.0~4.5 -55 º~150ºC PPM/℃ -60
Dielectric Constant 6.0~6.5 -55 º~150ºC PPM/℃ -210
Dielectric Constant 9.0~11.0 -55 º~150ºC PPM/℃ -260
Dielectric Constant 12.0~16.0 -55 º~150ºC PPM/℃ -205
Peel Strength 1 OZ Normal State N/mm >0.6
1 OZ After AC Humidity Test N/mm >0.4
Volume Resistivity Normal State 500V MΩ.cm >1×10^9
Surface Resistivity Normal State 500V >1×10^7
Coefficient of Thermal Expansion
(XY Z)
Dielectric Constant 3.00~6.15 -55 º~150ºC PPM/℃ 60,60,80
Dielectric Constant 6.16~11.0 -55 º~150ºC PPM/℃ 50,50,65
Dielectric Constant 11.1~16.0 -55 º~150ºC PPM/℃ 40,40,55
Water Absorption 20±2℃, 24 hours % ≤0.05
Long-Term Operating Temperature High-Low Temperature Chamber -80~200ºC
Material Composition Polytetrafluoroethylene (PTFE), ceramic, paired with ED copper foil.
The density and thermal conductivity data for materials with different dielectric constants are as follows:
Product Features Unit Dielectric Constant
3.0 4.4 6.0 6.15 9.2 9.6 10.2 16.0
Density g/cm3 2.41 2.58 2.78 2.79 3.0 3.02 3.07 3.27
Thermal Conductivity W/(M.K) 0.30 0.32 0.45 0.46 0.66 0.68 0.7 0.75