TF Series High Frequency PCB PTFE Ceramic Composite Adjusted DK Microwave Substrate

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

General Description

Dielectric substrate of PTFE ceramic composite - TF

The TF Series represents a premium class of high-frequency circuit laminates engineered for demanding microwave applications. These innovative materials combine temperature-resistant polytetrafluoroethylene (PTFE) resin with precisely formulated ceramic composites, creating an optimal substrate solution for high-frequency designs.

As a fiberglass-free construction, TF laminates achieve exceptional dielectric consistency and performance stability. The dielectric constant is meticulously controlled through precise adjustment of the ceramic-to-PTFE ratio, enabling customized electrical properties for specific application requirements. This unique formulation, coupled with specialized manufacturing processes, delivers outstanding dielectric performance and remarkable reliability in challenging operating environments.

The TF product family includes three distinct configurations to meet diverse design needs: TF base material features a smooth surface without copper cladding, TF-1 provides single-sided copper cladding, while TF-2 offers double-sided copper cladding. This comprehensive range ensures designers can select the optimal material configuration for their specific high-frequency circuit applications, from simple structures to complex multilayer designs.

These advanced TF series laminates are particularly suitable for microwave and millimeter-wave printed circuit boards, including applications in radar systems, antenna designs, transceivers, and various RF components where consistent electrical performance and material reliability are paramount.

Features

1. The dielectric constant ranges from 3 to 16 and is stable, including 3.0, 6.0, 9.2, 9.6, 10.2, and 16, with low dielectric loss.
2. Used for the fabrication of microwave and millimeter-wave printed circuit boards.
3. Long-term working temperature is higher than TP materials and can be used in the range of -80°C to +200°C.
4. Thickness options range from 0.635mm to 2.5mm.
5. Resistant to radiation and low outgassing.
6. Convenient for PCB processing, can be processed using methods suitable for thermoplastic materials.

Our PCB Capability (TF Series)

Data Sheet (TF Series)