Home - Microwave PCB - Rogers RO3210 Microwave PCB 2-Layer 0.635mm Circuit Board With Immersion Gold for Automotive Collision Avoidance Systems

Rogers RO3210 Microwave PCB 2-Layer 0.635mm Circuit Board With Immersion Gold for Automotive Collision Avoidance Systems

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Brief Introduction

Rogers RO3210 High-Frequency PCB Materials represent a class of ceramic-filled, woven fiberglass reinforced laminates engineered to deliver exceptional electrical performance and mechanical stability. RO3210 PCB materials combine the superior surface smoothness characteristic of non-woven PTFE laminates with enhanced processing capabilities. A key advantage of Rogers RO3210 laminates lies in their compatibility with standard PTFE circuit board fabrication techniques, enabling cost-effective mass production and competitive market pricing. The material exhibits a stable dielectric constant of 10.2 with an ultra-low dissipation factor of 0.0027, making Rogers RO3210 PCB an ideal solution for high-frequency applications requiring consistent electrical properties and reliable performance.

 

 

 

Typical applications:

1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems

 

PCB Specifications

Scrollable PCB Table
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Rogers RO3210 25mil 0.635mm High Frequency PCB for Automotive Collision Avoidance Systems
PCB SIZE 35 x 77 mm=2 designs = 2PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3210 0.635mm
copper ------- 18um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 6 mil / 6 mil
Minimum / Maximum Holes: 0.3 mm / 5.6 mm
Number of Different Holes: 2
Number of Drill Holes: 182
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3210 0.635mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 0.8 mm ±0.08
PLATING AND COATING
Surface Finish Immersion gold (23.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, v-cut
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059""
Board plating: 0.0029""
Drill tolerance: 0.002""
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Data Sheet of Rogers 3210 PCB

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RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103 COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79 j/g/k Calculated
Thermal Conductivity 0.81 W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D3850
Density 3 gm/cm3
Copper Peel Stength 11 pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes