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Double Sided Aluminum PCB Dual Layer Metal Core PCB Board for Switch Regulator

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Brief Introduction

This 2-layer metal core PCB features a 2.0mm overall thickness (typical) and provides >2000V AC electrical isolation. The board is constructed with 2oz copper on each layer and a thermally conductive dielectric (1 W/mK) bonded to an aluminum base. Fabrication complies with IPC-6012 Class 2 standards from supplied Gerber files. The solder mask and silkscreen inks are from Taiyo, and the core CCL plate is supplied by Totking. Standard pack quantity is 25 boards per shipment.

 

PCB Specifications:

PCB Electrical Properties Tables
Click to expand/collapse the table
PCB SIZE 500 x 150mm=10PCS
BOARD TYPE IMS mcpcb
Number of Layers Double sided PCB, Metal core PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 70um(2oz)
dielectric material 75um
copper ------- 70um(2oz)
dielectric material 75um
Aluminum backed 1.8mm 
TECHNOLOGY
Minimum Trace and Space: 5.98mil/6.18mil
Minimum / Maximum Holes: 0.3/2.2mm
Number of Different Holes: 5
Number of Drill Holes: 548
Number of Milled Slots: 11
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Thermal conductivity 2W / MK
Final foil external:  2oz
Final foil internal:  2oz
Final height of PCB:  2.1mm ±0.2
PLATING AND COATING
Surface Finish Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To:  Top, 12micon Minimum.
Solder Mask Color:  Super White for LED 
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA  via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Applications of Aluminum PCB:

 

Power Hybrid IC

Audio Frequency Apparatus:

Input / Output Amplifier, Balanced Amplifier, Pre-amplifier, Audio amplifier

Power supply device: Switch regulator, DC/AC Converter, Switch regulator

Communication electronic equipment: High frequency generator, Filter appliance, Transmission circuit

Office automation equipment: Motor drive

Automotive: Electronic regulator, Igniter, Power controller

Computer: CPU board, Floppy disk drive, Power supply unit

Power module: Converter, Solid relay, Rectifier bridge

Lamp lighting: All kinds of energy-saving and gorgeous LED lights

 

 

Layer up:

 

The most common MCPCB construction consists of the following three layers:

 

Metal Base Substrate, typically aluminum. Copper may be used for applications demanding higher thermal conductivity (401 W/mK versus 237 W/mK for aluminum), though at a greater cost.

 

Epoxy dielectric layer. This is the most critical layer, governing the board's thermal performance, electrical insulation strength, and solder joint reliability. A standard dielectric thermal conductivity is 1.0 W/mK, with higher values enhancing heat dissipation. While a thinner dielectric layer improves thermal transfer, it may compromise the board's ability to withstand high-voltage tests required by electrical safety standards, such as those in the lighting industry. The typical dielectric layer thickness is 100μm.

 

Top copper layer. A thicker copper layer improves lateral heat spreading but can challenge the fabrication of fine traces and spaces. Common copper weights are 1 oz (35μm) and 2 oz (70μm).

 

 

Manufacturing Process of MCPCB:

 

The process can be described as a flow diagram as follows.

 

Metal Core PCB Capability 2022:

Click to expand/collapse the table
NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-2 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm) 
17 Tolerance of NPTH ±0.00197" (0.05mm) 
18 Deviation of Hole Position  ±0.00394" (0.10mm) 
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm) 
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

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