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WL-CT High Frequency PCB Material

 

 

Introduction

 

The WL-CT series of organic polymer ceramic fiberglass cloth-covered copper boards is a thermosetting resin-based high-frequency material. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

 

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

 

The series offers a selection of dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.

 

These materials can be paired with standard ED copper foil or reverse-treated RTF copper foil. RTF copper foil offers excellent PIM (Passive Intermodulation) performance, reducing conductor loss and insertion loss. The back-treated RTF copper foil has an increased material thickness of 0.018mm (0.7mil), providing good adhesion.

 

The series can also be paired with aluminum-based substrates to create aluminum-based high-frequency materials.

 

The circuit boards can be processed using standard FR4 board fabrication techniques. The excellent mechanical and physical properties of the material allow for multiple lamination cycles, making it suitable for multi-layer, high-layer-count, and backplane processing. It exhibits excellent processability in dense hole and fine line routing.

 

 

Product Features:

 

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

The series offers a selection of dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.

These materials can be paired with standard ED copper foil or reverse-treated RTF copper foil. RTF copper foil offers excellent PIM (Passive Intermodulation) performance, reducing conductor loss and insertion loss. The back-treated RTF copper foil has an increased material thickness of 0.018mm (0.7mil), providing good adhesion.

The series can also be paired with aluminum-based substrates to create aluminum-based high-frequency materials.

The circuit boards can be processed using standard FR4 board fabrication techniques. The excellent mechanical and physical properties of the material allow for multiple lamination cycles, making it suitable for multi-layer, high-layer-count, and backplane processing. It exhibits excellent processability in dense hole and fine line routing.

 

Product Models & Data Sheet

 

Let’s explore the data sheet one by one:

 

 

Product Models

WL-CT300

WL-CT330

WL-CT330Z

WL-CT338

WL-CT350

WL-CT440

WL-CT61

 

 

Dielectric Constant (Typical):

Test Conditions: 10GHz

WL-CT300: 3.00

WL-CT330: 3.30

WL-CT330Z: 3.30

WL-CT338: 3.38

WL-CT350: 3.48

WL-CT440: 4.10

WL-CT615: 6.1

 

 

Dielectric Constant (Design):

Test Conditions: 10GHz

WL-CT300: 2.98

WL-CT330: 3.45

WL-CT330Z: 3.45

WL-CT338: 3.55

WL-CT350: 3.66

WL-CT440: 4.38

WL-CT615: 6.4

 

 

Dielectric Constant Tolerance:

 

WL-CT300: ±0.05

WL-CT330: ±0.06

WL-CT330Z: ±0.06

WL-CT338: ±0.05

WL-CT350: ±0.05

WL-CT440: ±0.08

WL-CT615: ±0.15

 

 

Loss Tangent (Typical):

Test Conditions:

2GHz

10GHz

20GHz

WL-CT300: 0.0025 / 0.0030 / 0.0036

WL-CT330: 0.0021 / 0.0026 / 0.0033

WL-CT330Z: 0.0025 / 0.0030 / 0.0035

WL-CT338: 0.0023 / 0.0029 / 0.0038

WL-CT350: 0.0030 / 0.0039 / 0.0048

WL-CT440: 0.0040 / 0.0050 / /

WL-CT615: 0.0032 / 0.0040 / /

 

 

Dielectric Constant Temperature Coefficient:

Test Conditions: -55 ºC to 150ºC

Unit: PPM/℃

WL-CT300: 27

WL-CT330: 43

WL-CT330Z: 43

WL-CT338: 45

WL-CT350: 52

WL-CT440: -21

WL-CT615: -122

 

 

Peel Strength:

Test Conditions: 1 OZ RTF copper

Unit: N/mm

WL-CT300: 0.85

WL-CT330: 1.0

WL-CT330Z: 0.85

WL-CT338: 1.0

WL-CT350: 0.85

WL-CT440: 1.0

WL-CT615: 0.9

 

 

 

 

Volume Resistivity

Test Conditions: Standard Condition

Unit: MΩ.cm

WL-CT300: 3×10^8

WL-CT330: 5×10^9

WL-CT330Z: 5×10^9

WL-CT338: 6×10^9

WL-CT350: 1×10^9

WL-CT440: 1×10^9

WL-CT615: 2×10^

 

 

 

 

Surface Resistivity:

Test Conditions: Standard Condition

Unit: MΩ

WL-CT300: 2×10^8

WL-CT330: 5×10^9

WL-CT330Z: 5×10^9

WL-CT338: 7×10^8

WL-CT350: 4×10^9

WL-CT440: 5×10^7

WL-CT615: 5×10^6

 

 

Electrical Strength (Z direction):

Test Conditions: 5KW, 500V/s

Unit: KV/mm

WL-CT300: 28

WL-CT330: 22

WL-CT330Z: 22

WL-CT338: 31

WL-CT350: 31

WL-CT440: 27

WL-CT615: 30

 

 

Breakdown Voltage (XY direction):

Test Conditions: 5KW, 500V/s

Unit: KV

WL-CT300: 35

WL-CT330: 22

WL-CT330Z: 22

WL-CT338: 30

WL-CT350: 30

WL-CT440: 25

WL-CT615: 25

 

 

Coefficient of Thermal Expansion (X, Y direction):

Test Conditions: -55 ºC to 288ºC

Unit: ppm/ºC

WL-CT300: 15, 14

WL-CT330: 15, 13

WL-CT330Z: 15, 13

WL-CT338: 14, 16

WL-CT350: 11, 14

WL-CT440: 14, 18

WL-CT615: 15, 17

 

 

Coefficient of Thermal Expansion (Z direction):

Test Conditions: -55 ºC to 288ºC

Unit: ppm/ºC

WL-CT300: 31

WL-CT330: 39

WL-CT330Z: 39

WL-CT338: 50

WL-CT350: 34

WL-CT440: 35

WL-CT615: 33

 

 

Thermal Stress:

Test Conditions: 288℃, 10s, 3 times

Result: No Delamination

 

  

Water Absorption:

Test Conditions: 20±2℃, 24 hours

Unit: %

WL-CT300: 0.15

WL-CT330: 0.02

WL-CT330Z: 0.05

WL-CT338: 0.04

WL-CT350: 0.05

WL-CT440: 0.12

WL-CT615: 0.08

 

 

Density:

Test Conditions: Room Temperature

Unit: g/cm3

WL-CT300: 1.57

WL-CT330: 1.82

WL-CT330Z: 1.78

WL-CT338: 1.78

WL-CT350: 1.90

WL-CT440: 2.00

WL-CT615: 2.18

 

 

Long-Term Operating Temperature:

Test Conditions: High-Low Temperature Chamber

Unit: ℃

WL-CT300: -55 to +260

WL-CT330: -55 to +260

WL-CT330Z: -55 to +260

WL-CT338: -55 to +260

WL-CT350: -55 to +260

WL-CT440: -55 to +260

WL-CT615: -55 to +260

Flammability:

Test Conditions: UL 94

WL-CT300: V-0

WL-CT330: V-0

WL-CT330Z: V-0

WL-CT338: V-0

WL-CT350: V-0

WL-CT440: V-0

WL-CT615: V-0

Product Technical Parameters

Product Models & Data Sheet

Product Features

Test Conditions

Unit

WL-CT300

WL-CT330

WL-CT330Z

WL-CT338

WL-CT350

WL-CT440

WL-CT615

Dielectric Constant (Typical)

10GHz

/

3.00

3.30

3.30

3.38

3.48

4.10

6.15

Dielectric Constant (Design)

10GHz

/

2.98

3.45

3.45

3.55

3.66

4.38

6.4

Dielectric Constant Tolerance

/

/

±0.05

±0.06

±0.06

±0.05

±0.05

±0.08

±0.15

Loss Tangent (Typical)

2GHz

/

0.0025

0.0021

0.0025

0.0023

0.0030

0.0040

0.0032

10GHz

/

0.0030

0.0026

0.0030

0.0029

0.0039

0.0050

0.0040

20GHz

/

0.0036

0.0033

0.0035

0.0038

0.0048

/

/

Dielectric Constant Temperature Coefficient

-55 º~150ºC

PPM/℃

27

43

43

45

52

-21

-122

Peel Strength

1 OZ RTF copper

N/mm

0.85

1.0

0.85

1.0

0.85

1.0

0.9

1 OZ RTFcopper

N/mm

0.72

0.72

0.72

0.72

0.72

Not compatible

Not compatible

Volume Resistivity

Standard Condition

MΩ.cm

3×10^8

5×10^9

5×10^9

6×10^9

1×10^9

1×10^9

2×10^7

Surface Resistivity

Standard Condition

2×10^8

5×10^9

5×10^9

7×10^8

4×10^9

5×10^7

5×10^6

Electrical Strength (Z direction)

5KW500V/s

KV/mm

28

22

22

31

31

27

30

Breakdown Voltage (XY direction)

5KW500V/s

KV

35

22

22

30

30

25

25

Coefficientof Thermal Expansion (X, Y direction)

-55 º~288ºC

ppm/ºC

15, 14

15, 13

15, 13

14, 16

11, 14

14, 18

15, 17

Coefficientof Thermal Expansion (Z direction)

-55 º~288ºC

ppm/ºC

31

39

39

50

34

35

33

Thermal Stress

288℃, 10s3 times

/

No Delamination

No Delamination

No Delamination

No Delamination

No Delamination

No Delamination

No Delamination

Water Absorption

20±2℃, 24 hours

%

0.15

0.02

0.05

0.04

0.05

0.12

0.08

Density

Room Temperature

g/cm3

1.57

1.82

1.78

1.78

1.90

2.00

2.18

Long-Term Operating Temperature

High-Low Temperature Chamber

-55+260

-55+260

-55+260

-55+260

-55+260

-55+260

-55+260

Thermal Conductivity

Z direction

W/(M.K)

0.41

0.59

0.59

0.70

0.70

0.66

0.72

PIM

Paired with RTF copper foil.

dBc

≤-158

≤-157

≤-157

≤-158

≤-157

N/A

N/A

Flammability

UL-94

Grade

V-0

Non-flame retardant

V-0

Non-flame retardant

V-0

V-0

V-0

TG

Standard

>280℃

>280℃

>280℃

>280℃

>280℃

>280℃

>280℃

TD

Initial Value

412

421

386

421

386

402

398

Halogen

Yes

No

Yes

No

Yes

Yes

No

Material Composition

Hydrocarbon + Ceramic + Fiberglass cloth

 

Our PCB Capability (WL-CT)

Our capabilities include the following specifications:

 

 

Layer count: We can manufacture single-sided, double-sided PCBs, as well as multilayer PCBs and hybrid PCBs.

 

 

Copper weight: We offer options for copper weight, including 1oz (35µm) and 2oz (70µm).

 

 

Dielectric thickness:

For ED Copper:

4mil (with no TRF Copper)

8mil with TRF Copper of 8.7mil

12mil (with no TRF Copper)

16mil (with no TRF Copper)

20mil with TRF Copper of 20.7mil

28mil (with no TRF Copper)

32mil with TRF Copper of 32.7mil

40mil with TRF Copper of 40.7mil

60mil with TRF Copper of 60.7mil

80mil with TRF Copper of 80.7mil

 

 

PCB size: We can accommodate PCB sizes up to 400mm X 500mm.

 

 

Solder mask: We offer a range of solder mask colors such as green, black, blue, yellow, red, and more.

 

 

Surface finish: Our surface finish options include bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), immersion silver, immersion tin, OSP (Organic Solderability Preservative), pure gold, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and more.

 

PCB Capability (WL-CT Series)

PCB Material:

Hydrocarbon resin, ceramic, and glass fiber cloth

Designation

(WL-CT Series)

Designation

DK

DF

WL-CT300

3.0±0.05

0.0030

WL-CT330

3.3±0.06

0.0026

WL-CT330Z

3.3±0.06

0.0030

WL-CT338

3.38±0.05

0.0029

WL-CT350

3.48±0.05

0.0039

WL-CT440

4.1±0.08

0.0050

WL-CT615

6.15±0.15

0.0040

Layer count:

Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness

ED Copper

TRF Copper

4mil

/

8mil

8.7mil

12mil

/

16mil

/

20mil

20.7mil

28mil

/

32mil

32.7mil

40mil

40.7mil

60mil

60.7mil

80mil

80.7mil

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

A WL-CT PCB and Applications

 

Displayed on the screen is a double-sided 1.6mm WL-CT338 PCB with immersion gold coating specifically designed for filters. WL-CT PCBs are versatile and widely used in various applications, including:

Base station antennas and satellite antennas.

Automotive radar, sensors, and navigation systems.

Power amplifiers.

Satellite high-frequency heads.

RF devices and filters.

WIMAX antennas and distributed antennas.

Small-sized patch antennas.

 

 

 

 

Final (WL-CT series aluminum-based boards)

 

This series of laminates provides aluminum-based substrates, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based layer. It serves for shielding or heat dissipation purposes. The model numbers are WL-CT***-AL. For instance, WL-CT350-AL represents WL-CT350 with an aluminum-based substrate.