TP440 RF PCB Materials Introduction TP440 laminate is a high-performance high-frequency thermoplastic PCB material that stands out as a key model in the industry’s TP series, featuring a unique composition and specialized properties tailored for high-frequency application scenarios. Its dielectric layer is specifically formulated with a precise blend of ceramics and polyphenylene oxide (PPO) resin, and unlike many traditional high-frequency laminates, it contains no fiberglass reinforcement—an innovative design that contributes to its exceptional dielectric performance. The dielectric constant of TP440 laminate is precisely calibrated to 4.4 with a tight tolerance of ±0.09, a specification achieved through strict control of the ratio between ceramics and PPO resin in its dielectric layer, ensuring consistent electrical performance across all batches of the material. Complementing its stable dielectric constant, TP440 also boasts an ultra-low dissipation factor of 0.0010 at 5GHz, minimizing signal loss even in high-frequency transmission and making it highly suitable for designs that demand superior signal integrity. Equipped with a special production process that optimizes the integration of its ceramic and PPO resin components, TP440 high frequency circuit material delivers excellent overall dielectric performance and high reliability, capable of maintaining stable properties in various operating environments. It also features a temperature coefficient of dielectric constant (TcDk) of -46 ppm/°C and a Z-axis thermal expansion coefficient of 70 ppm/°C, further enhancing its temperature stability and ensuring consistent performance even when exposed to fluctuations in operating temperature. In line with the TP series standard configurations, TP440 laminate is available in three different forms to accommodate diverse application needs: the smooth surface non-copper-clad variant (referred to as TP), the single-sided copper-clad variant (TP-1), and the double-sided copper-clad variant (TP-2), providing flexibility for different PCB manufacturing requirements while retaining all its core high-frequency and reliability advantages. Product Features: 1.The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz. 2.Long-term operating temperature ranges from -100°C to +150°C. It has excellent low-temperature resistance. When the temperature exceeds 180°C, the material may deform, the copper foil may peel off, and there may be significant changes in electrical performance. 3.The thinnest thickness is 0.5mm, and it is available in various thicknesses and can be customized. 4.It is resistant to radiation and has low outgassing. 5.Ideal material for Beidou, missile-borne, fuze, and miniaturized antennas. 6.The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine and can be processed through drilling, turning, grinding, shearing, etching, and other methods, which ceramic substrates cannot achieve. 7.Convenient for PCB processing, it can be processed using methods suitable for thermoplastic materials, resulting in high yield and reduced processing cost compared to ceramic substrates. Due to the characteristics of the material, it is generally not recommended for multilayer PCB processing. If multilayer PCB processing is required, low-temperature bonding sheets should be selected, and feasibility should be fully considered Data Sheet Let's go through each parameter and its corresponding values: Dielectric Constant: TP300: The dielectric constant for TP300 is 3.0 with a tolerance of ±0.06. TP440: The dielectric constant for TP440 is 4.4 with a tolerance of ±0.09. TP600: The dielectric constant for TP600 is 6.0 with a tolerance of ±0.12. TP615: The dielectric constant is 6.15 with a tolerance of ±0.12. TP920: The dielectric constant is 9.2 with a tolerance of ±0.18. TP960: The dielectric constant is 9.6 with a tolerance of ±0.19. TP1020: The dielectric constant is 10.2 with a tolerance of ±0.2. TP1100: The dielectric constant is 11.0 with a tolerance of ±0.022. TP1600: The dielectric constant is 16.0 with a tolerance of ±0.4. TP2000: The dielectric constant is 20.0 with a tolerance of ±0.8. TP2200: The dielectric constant is 22.0 with a tolerance of ±0.88. TP2500: The dielectric constant is 25.0 with a tolerance of ±1.0. The dielectric constant can be customized within the range of 3.0 to 25 Dielectric Constant Tolerance: For dielectric constants ranging from 3.0 to 11.0, the tolerance is ±2%. For dielectric constants ranging from 11.1 to 16.0, the tolerance is ±2.5%. For dielectric constants ranging from 16.1 to 25.0, the tolerance is ±4%. Loss Tangent: Loss Tangent for dielectric constants ranging from 3.0 to 9.5 at 10GHz is 0.0010. Loss Tangent for dielectric constants ranging from 9.6 to 11.0 at 10GHz is 0.0012. Loss Tangent for dielectric constants ranging from 11.1 to 16.0 at 5GHz is 0.0015. Loss Tangent for dielectric constants ranging from 16.1 to 25.0 at 5GHz is 0.0020 to 0.0025. Dielectric Constant Temperature Coefficient: For dielectric constants ranging from 3.0 to 9.5, the temperature coefficient is -50 PPM/℃ (-55 ºC to 150 ºC). For dielectric constants ranging from 9.6 to 16.0, the temperature coefficient is -40 PPM/℃ (-55 ºC to 150 ºC). For dielectric constants ranging from 16.1 to 25.0, the temperature coefficient is -55 PPM/℃ (-55 ºC to 150 ºC). Peel Strength: Peel Strength in the normal state with 1 oz copper is greater than 0.6 N/mm. Peel Strength after AC humidity test with 1 oz copper is greater than 0.4 N/mm. Volume Resistivity: Volume Resistivity in the normal state at 500V is greater than 1×10^9 MΩ.cm. Surface Resistivity: Surface Resistivity in the normal state at 500V is greater than 1×10^7 MΩ. Coefficient of Thermal Expansion (XY Z): The coefficient of thermal expansion varies based on the dielectric constant range. Water Absorption: Water Absorption at 20±2℃ for 24 hours is less than or equal to 0.01%. Long-Term Operating Temperature: The long-term operating temperature range is from -100ºC to 150ºC. Material Composition: The laminate is composed of polyphenylene ether, ceramic, and paired with ED copper foil Product Technical Parameter Product Models & Data Sheet Product Features Test Conditions Unit TP TP-1 TP-2 Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz. / 3.0±0.06 4.4±0.09 6.0±0.12 6.15±0.12 9.2±0.18 9.6±0.19 10.2±0.2 11.0±0.022 16.0±0.4 20.0±0.8 22.0±0.88 25.0±1.0 The dielectric constant can be customized within the range of 3.0 to 25. Dielectric Constant Tolerance Dielectric Constant 3.0～11.0 / ±2% Dielectric Constant 11.1～16.0 / ±2.5% Dielectric Constant 16.1～25.0 / ±4% Loss Tangent Loss Tangent?3.0～9.5 10GHz / 0.0010 Loss Tangent?9.6～11.0 10GHz / 0.0012 Loss Tangent 11.1～16.0 5GHz / 0.0015 Loss Tangent 16.1～25.0 5GHz / 0.0020～0.0025 Dielectric Constant Temperature Coefficient Dielectric Constant 3.0～9.5 -55 º~150ºC PPM/℃ -50 Dielectric Constant 9.6～16.0 -55 º~150ºC PPM/℃ -40 Dielectric Constant 16.1～25.0 -55 º~150ºC PPM/℃ -55 Peel Strength 1 OZ Normal State N/mm >0.6 1 OZ After AC Humidity Test N/mm >0.4 Volume Resistivity Normal State at 500V MΩ.cm >1×10^9 Surface Resistivity Normal State at 500V MΩ >1×10^7 Coefficient of Thermal Expansion Dielectric Constant 3.00～4.40 -55 º~150ºC PPM/℃ 60,60,70 Dielectric Constant 4.60～6.15 -55 º~150ºC PPM/℃ 50,50,60 Dielectric Constant 6.16～11.0 -55 º~150ºC PPM/℃ 40,40,55 Dielectric Constant 11.1～16.0 -55 º~150ºC PPM/℃ 40,40,50 Dielectric Constant 16.1～25.0 -55 º~150ºC PPM/℃ 35,35,40 Water Absorption 20±2℃, 24 hours % ≤0.01 Long-Term Operating Temperature High-Low Temperature Chamber ℃ -100º~150ºC Material Composition Polyphenylene ether, ceramic, paired with ED copper foil. The density and thermal conductivity data for materials with different dielectric constants are as follows: Product Features Unit Dielectric Constanct 3.0 4.4 6.0 6.15 9.6 10.2 11.0 16.0 20.0 22.0 25.0 Density g/cm3 1.69 1.89 2.1 2.12 2.26 2.33 2.40 2.76 2.73 2.77 2.94 Thermal Conductivity W/(M.K) 0.40 0.44 0.55 0.55 0.65 0.67 0.70 0.80 0.85 0.90 1.0 A TP440 Laminate and Applications On the screen, you can see a TP440 high-frequency laminate. TP440 high-frequency PCB materials are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas. Final Attention TP series PCB material is not suitable for 260°C thermal shock testing and cannot be wave soldered. Hand soldering with a constant temperature soldering iron is recommended. Reflow soldering is generally not recommended. If reflow soldering is carried out, the highest set temperature should not exceed 200°C, and feasibility and stability should be fully considered.
When the dielectric constant is >11, the test condition is 5GHz.
(XY Z)
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