TP300 High Frequency PCB Material Introduction TP PCB material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 refers to the material with copper cladding on one side, and TP-2 refers to the material with copper cladding on both sides. Product Features: 1.The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz 2.Long-term operating temperature ranges from -100°C to +150°C. It has excellent low-temperature resistance. When the temperature exceeds 180°C, the material may deform, the copper foil may peel off, and there may be significant changes in electrical performance. 3.The thinnest thickness is 0.5mm, and it is available in various thicknesses and can be customized. 4.It is resistant to radiation and has low outgassing. 5.Ideal material for Beidou, missile-borne, fuze, and miniaturized antennas. 6.The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine and can be processed through drilling, turning, grinding, shearing, etching, and other methods, which ceramic substrates cannot achieve. 7.Convenient for PCB processing, it can be processed using methods suitable for thermoplastic materials, resulting in high yield and reduced processing cost compared to ceramic substrates. Due to the characteristics of the material, it is generally not recommended for multilayer PCB processing. If multilayer PCB processing is required, low-temperature bonding sheets should be selected, and feasibility should be fully considered Data Sheet Let's go through each parameter and its corresponding values: Dielectric Constant: TP300: The dielectric constant for TP300 is 3.0 with a tolerance of ±0.06. TP440: The dielectric constant for TP440 is 4.4 with a tolerance of ±0.09. TP600: The dielectric constant for TP600 is 6.0 with a tolerance of ±0.12
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