Rogers RO3203 High Frequency PCB Material Introduction RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. RO3203 material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency PCB Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz. Rogers RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system. Features: 1. Woven glass reinforcement improves rigidity for easier handling. 2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures. 3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz. 4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs. 5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies. 6. Excellent dimensional stability for high production yields. 7. Economically priced for volume manufacturing. 8. Surface smoothness allows for finer line etching tolerances Typical Applications: 1. Automotive Collision Avoidance Systems 2. Automotive Global Positioning Satellite Antennas 3. Base Station Infrastructure 4. Datalink on Cable Systems 5. Direct Broadcast Satellites 6. LMDS and Wireless Broadband 7. Microstrip Patch Antennas 8. Power Backplanes 9. Remote Meter Readers 10. Wireless Telecommunications Systems PCB Capability (RO3203) PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3203 Dielectric constant: 3.02±0.04 Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 0.5oz (17 μm), 1oz (35μm), 2oz (70μm) Laminate thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP etc.. Data Sheet of RO3203 Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518 Volume Resistivity 107 MΩ.cm A ASTM D257 Surface Resistivity 107 MΩ A ASTM D257 Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9 Tensile Modulus X, Y kpsi RT ASTM D638 Flexural Modulus 400, 300 X, Y kpsi A ASTM D790 Tensile Strength 12.5, 13 X, Y kpsi RT ASTM D638 Flexural Strength 9, 8 X, Y kpsi A ASTM D790 Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1 Coefficient of Thermal Expansion 58, 13 Z, X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386 Td 500 ℃ TGA ASTM D3850 Density 2.1 gm/cm3 23℃ ASTM D792 Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8 Flammability V-0 UL 94 Lead-Free Process Compatible Yes 
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