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Home - High frequency PCB - Rogers CLTE-XT High-Frequency PCBs Ceramic-Filled Woven Glass-Reinforced PTFE Circuit Boards in 9.4mil 25mil 40mil and 59mil

Rogers CLTE-XT High-Frequency PCBs Ceramic-Filled Woven Glass-Reinforced PTFE Circuit Boards in 9.4mil 25mil 40mil and 59mil

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Introduction

Rogers CLTE-XT High-Frequency PCBs are composite materials composed of polytetrafluoroethylene (PTFE), woven fiberglass reinforcement, and micro-dispersed ceramic filler. Designed to enhance loss tangent, these laminates simultaneously maintain strong dimensional stability—ensuring minimal warpage or deformation during processing—and deliver excellent thermal reliability, making them resilient to temperature fluctuations. Additionally, they retain high-caliber electrical performance, making them well-suited for applications that demand consistent signal integrity and durability in high-frequency or harsh operating environments.

 

RO4003C PCB 板材外观

 

Features and Benefits

  1. Copper matched CTE in X and Y axis
  2. Low Z-direction CTE of 20 ppm /°C
  3. Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability
  4. Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change
  5. High reliability on plated through holes
  6. 0.02% low moisture absorption
  7. Great number of NASA outgassing values.
  8. High thermal conductivity of 0.56 W/m/K

 

Our PCB Capability (CLTE-XT laminates)

PCB Electrical Properties Tables
Click to expand/collapse the table
PCB Capability (CLTE-XT Laminates)
PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc..

 

Typical Applications

1. Advanced Driver Assistance Systems (ADAS)

2. CNI (communication, navigation and identification) Applications

3. Defense Microwave/RF Applications

4. Microwave Feed Networks

5. Phased Array Antennas

6. Power Amplifiers

7. Patch Antennas

8. Radar Manifolds

9. Satellite & Space Electronics

Data Sheet (CLTE-XT laminates)

 

Click to expand/collapse the table
Properties CLTE-XT Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.79 (5.1mil) - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
2.89 (9.4mil)
2.92 (20mil)
2.94 (30mil)
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
(9)		 N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)		 MPa (ksi ) 25˚C  3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)		 MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)		 MPa (ksi ) 25C  3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NATA Outgassing
Total Mass Lost 0.02 % - - ASTM E595
Collected Volatiles Condensable Material 0

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9.4mil 25mil 40mil and 59mil CLTE-XT PCB Rogers CLTE-XT High-Frequency PCB Rogers CLTE-XT PCB Datasheet CLTE-XT PTFE based PCB CLTE-XT Loss Tangent PCB Rogers CLTE-XT Circuit Board PCB