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Rogers AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil With Immersion Gold and Immersion Silver
Rogers AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil With Immersion Gold and Immersion Silver
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Introduction
Rogers AD255C PCBs are high-performance, glass-reinforced PTFE composites meticulously designed to meet the rigorous demands of modern wireless antenna systems. AD255C PCB materials offer a tightly controlled dielectric constant of 2.55, ultra-low loss performance (dissipation factor of 0.0013 at 10 GHz with ED or reverse-treated copper), and exceptional passive intermodulation (PIM) stability, ensuring minimal signal distortion in high-power applications. Available in thicknesses ranging from 20 to 125 mils, AD255C substrates empower antenna designers to optimize impedance matching, reduce insertion loss, and enhance overall system efficiency across 5G, IoT, and aerospace applications.
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Our PCB Capability (AD255C PCB)
PCB Capability (AD255C) |
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PCB Material: |
Glass-reinforced, PTFE based Composites |
Designation: |
AD255C |
Dielectric constant: |
2.55 (10 GHz) |
Dissipation Factor |
0.0013 (10 GHz) |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness: |
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc.. |
Typical Applications
Automotive telematics antenna systems
Cellular infrastructure base station antenna
Commercial satellite radio antenna
About Us
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 20 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
Our PCBs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, telecommunication, automotive electronics, medical apparatus and instruments, national defense and industrial equipment etc.
Our advantages
- Powerful PCB capabilities support your research and development, sales and marketing;
- PCB Products and Manufacturing are certified by authorized organizations;
- 16000㎡ workshop with 30000㎡ output capability and 8000 types of PCB's per month;
- Quick CADCAM checking and free PCB quotation;
- No minimum order quantity. 1 piece is available;
- A Team with passion, discipline, responsibility and honesty;
- More than 19+ years of high frequency PCB experience;
- Prototype PCB capability to Volume Production capability;
- Delivery on time: >98%, Customer complaint rate: <1%
- IPC Class 2 / IPC Class 3;
Appendix: Typical Values of AD255C
Electrical Properties | AD255C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.55 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.60 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -110 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 7.4 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 3.6 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 911 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 34 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 26 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.35 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.4 (13.6) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 8.1/6.6 (55.8/45.5) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 930/818 (6,412/5,640) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.03/0.07 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.03 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |