Home - High frequency PCB - Rogers AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil With Immersion Gold and Immersion Silver

Rogers AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil With Immersion Gold and Immersion Silver

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Introduction

Rogers AD255C PCBs are high-performance, glass-reinforced PTFE composites meticulously designed to meet the rigorous demands of modern wireless antenna systems. AD255C PCB materials offer a tightly controlled dielectric constant of 2.55, ultra-low loss performance (dissipation factor of 0.0013 at 10 GHz with ED or reverse-treated copper), and exceptional passive intermodulation (PIM) stability, ensuring minimal signal distortion in high-power applications. Available in thicknesses ranging from 20 to 125 mils, AD255C substrates empower antenna designers to optimize impedance matching, reduce insertion loss, and enhance overall system efficiency across 5G, IoT, and aerospace applications.

 

RO4003C PCB 板材外观

 

Our PCB Capability (AD255C PCB)

PCB Capability (AD255C)

PCB Material:

 Glass-reinforced, PTFE based Composites

Designation:

AD255C

Dielectric constant:

2.55  (10 GHz)

Dissipation Factor

0.0013 (10 GHz)

Layer count:

Double Sided PCB, Multilayer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness:

20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..

 

Typical Applications

Automotive telematics antenna systems

Cellular infrastructure base station antenna

Commercial satellite radio antenna

 

 

About Us

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 20 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.

Our PCBs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, telecommunication, automotive electronics, medical apparatus and instruments, national defense and industrial equipment etc.

Our advantages

  1. Powerful PCB capabilities support your research and development, sales and marketing;
  2. PCB Products and Manufacturing are certified by authorized organizations;
  3. 16000workshop with 30000output capability and 8000 types of PCB's per month;
  4. Quick CADCAM checking and free PCB quotation;
  5. No minimum order quantity. 1 piece is available;
  6. A Team with passion, discipline, responsibility and honesty;
  7. More than 19+ years of high frequency PCB experience;
  8. Prototype PCB capability to Volume Production capability;
  9. Delivery on time: >98%, Customer complaint rate: <1%
  10. IPC Class 2 / IPC Class 3;

Appendix: Typical Values of AD255C

     

Scrollable PCB Table
Click to expand/collapse the table
Electrical Properties AD255C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
(13.6)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716