0.1mm to 10mm Advanced High-Temperature Resistant and High-Frequency Polyimide PCBs for Harsh Environments

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

Introduction

TB-73 Polyimide PCBs are engineered as high-temperature-resistant, high-frequency polyimide copper-clad materials, purpose-built to perform reliably under extreme thermal and high-frequency conditions. These laminates serve as a foundational material for manufacturing specialized high-temperature, high-frequency circuit boards—critical components in electronic equipment across demanding industries including aerospace, aviation, military, and underground petroleum exploration.

Key attributes of TB-73 include exceptional high-frequency dielectric performance, robust resistance to elevated temperatures, and tolerance to radiation—qualities that make it indispensable for environments where standard materials would degrade. Available in nominal thicknesses ranging from 0.1mm to 10mm, the laminates offer versatility to meet diverse design requirements in high-stakes applications.

Chemical Test Report

TB-73 PCB complies with the technical specifications outlined in standard Q/XA50089-2004, having successfully passed a comprehensive series of tests to validate its quality and performance. The peel strength of TB-73 after thermal stress meets the minimum requirement of ≥1.0 N/mm, with an actual test result of 1.42 N/mm (pass); its peel strength at 170℃ also satisfies the standard’s ≥0.7 N/mm requirement (pass), confirming reliable adhesion even under elevated temperatures.

For volume resistivity, TB-73 performs well across two key standards: per the C-96/35/90 standard, the minimum requirement is ≥5×10⁶ MΩ·cm, and the actual test result reaches 6.6×10⁷ MΩ·cm (pass); per the E-24/204 standard, the minimum requirement remains ≥5×10⁶ MΩ·cm, with an actual result of 6.2×10⁸ MΩ·cm (pass), demonstrating strong electrical insulation properties. Surface resistivity is equally compliant, with actual results of 3.4×10⁷ MΩ (per C-96/35/90) and 2.3×10⁸ MΩ (per E-24/204), both falling within the specified range (pass).

TB-73 also excels in environmental and dielectric performance: its moisture absorption rate is as low as 0.11%, well below the maximum limit of ≤0.35% (pass), reducing the risk of performance degradation from moisture intrusion; the breakdown voltage tests at 44.3 kV, exceeding the minimum requirement of 40 kV (pass), ensuring safety in high-voltage scenarios. At 1MHz, the dielectric constant is 4.12 (≤4.5, pass) and the dissipation factor is 0.0072 (≤0.01, pass), supporting stable signal transmission in high-frequency applications.

In mechanical and thermal performance, TB-73 meets all standards: its bending strength reaches ≥400 N/mm² in the machine direction and ≥300 N/mm² in the cross direction (both pass), providing structural durability; it withstands thermal stress at 288℃ for 180 seconds without delamination or blistering, proving resilience in extreme heat. The glass transition temperature (Tg value) is 257℃, fully meeting the specified requirement. All tested parameters confirm that TB-73 meets or exceeds the standards for high-performance applications in demanding environments.

Our PCB Capability (TB-73 Polyimide RF PCB)

PCB Electrical Properties Tables

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PCB Capability (TB-73 Polyimide RF PCB)
PCB material:	Polyimide Glass Fabric Copper-clad Laminates
Designation:	TB-73
Dielectric constant:	4.12
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	5mil (0.127mm), 10mil(0.254mm), 20mil (0.508mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm) etc.
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Electroless Nickel and Immersion Gold (ENIG), HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Pure gold plated etc..

About Bicheng

Bicheng PCB is a leading supplier of high-quality printed circuit boards (PCBs) based in Shenzhen, China. Established in 2003, the company has over 20 years of experience in the industry and has built a reputation for delivering reliable and cost-effective PCB solutions to customers across the globe.

Bicheng PCB's manufacturing capabilities cover a wide range of PCB types, including single-sided, double-sided, and multilayer boards, with layer counts ranging from 1 to 32. The company's PCBs are used in a variety of industries, including telecommunications, aerospace, defense, medical, and industrial electronics.

Bicheng PCB offers a wide range of substrate materials for its PCBs, including high-frequency materials such as RO4003C, RO4350B, and RO4730G3, as well as standard FR-4 materials like high-Tg S1000-2M, TU-872 SLK, TU-768, IT-180A, and Isola 370HR. The company also offers metal core, polyimide, and PET substrates, among others.

Bicheng PCB's advanced manufacturing capabilities allow for a range of options that can be customized to meet specific customer needs. For example, the company can produce PCBs in sizes up to 1100mm by 600mm, with a board outline tolerance of ±0.0059" (0.15mm) and thickness tolerance of ±8% for T≥0.8mm and ±10% for t＜0.8mm. The company can also accommodate a range of copper thicknesses, from 17µm to 350µm (0.5oz to 10oz), and drill hole diameters from 0.0079" to 0.25" (0.2mm to 6.35mm).

Bicheng PCB's commitment to quality and customer satisfaction is reflected in its ISO 9001:2015 certification. The company's experienced engineers and technicians work closely with customers to ensure that their specific requirements are met and that their PCBs are delivered on time and within budget.

Appendix: Data Sheet (TB-73 laminates)