Home - High DK 6.0-6.9 Substrates - Taconic RF-60TC High Frequency Circuit Materials

 

 

Taconic RF-60TC High Frequency Circuit Materials

 

 

Introduction

 

Hello everyone. Welcome back to our channel. Today we are going introduce a type of improved heat dissipation and exceptional low loss laminate ---Taconic RF-60TC high frequency laminate.

 

Taconic RF-60TC is composed of a PTFE-based, ceramic-filled fiberglass substrate. High power RF and microwave applications can use RF-60TC laminate as their basic material. Through enhanced dielectric heat dissipation and extraordinarily low dielectric losses, RF-60TC PCB material is intended to deliver lower operating temperatures in high power applications and greater gains and efficiencies in miniaturized antenna applications for the 6.15 DK market.

 

Now let’s see the detailed properties.

 

 

RF-60TC Typical Properties

 

The Dk, or dielectric constant, of RF-60TC at 10 GHz is 6.15 ± 0.15, while the Df, or dielectric loss tangent, is 0.002.

 

Dielectric breakdown is 55 kV, while the dielectric strength is 550 V/mil.

 

 

The arc resistance lasts longer than 180 seconds, and the surface resistivity and volume resistivity are both 1.0 x 10^8 Mohm after humidity exposure.

 

Moving on to the mechanical properties, the flexural strength in the machine direction is 10,000 psi, while the flexural strength in the cross direction is 9,000 psi.

 

The tensile strength in the MD is 9,000 psi, while the tensile strength in the CD is 7,000 psi.

 

The Young's modulus in the MD is 721 kpsi, and the Poisson's ratio in the MD is 0.155.

 

The dimensional stability in the MD after bake is 0.01 mils/in, while the dimensional stability in the CD after bake is 0.69 mils/in.

 

The dimensional stability in the MD after thermal stress is 0.06 mils/in, while the dimensional stability in the CD after thermal stress is 0.8 mils/in.

 

Moving on to the thermal properties, the thermal conductivity for this material is 0.9 W/MK for unclad, 1 W/MK for half ounces, and 1.05 W/MK for 1oz copper.

 

The TCDk value of RF-60TC is -3.581 ppm/°C, while the CTE for the X and Y axis is 9.9 ppm/°C and the CTE for the Z axis is 40 ppm/°C.

 

Finally, the physical properties of RF-60TC include a moisture absorption of 0.03%, a peel strength of 8 lbs/in for 1 oz. ED copper, a density of 2.84 g/cm3, a specific heat of 0.94 J/gK, a Td of 500°C for 2% weight loss, a Td of 515°C for 5% weight loss, and a flammability rating of V-0 according to UL 94.

 

 

Property

Unit

RF-60TC Value

Test Method

Electrical Properties

Dk @ 10 GHz

 

6.15 ± 0.15

IPC-650 2.5.5.5.1 (Modified)

Df @ 10 GHz

 

0.002

IPC-650 2.5.5.5.1 (Modified)

Dielectric Breakdown

kV

55

IPC-650 2.5.6

Dielectric Strength

V/mil (V/mm)

550 (21,654)

IPC-650 2.5.6.2

Arc Resistance

Seconds

>180

IPC-650 2.5.1

Surface Resistivity

Mohm

1.0 x 108

IPC-650 2.5.17.1 (After Humidity)

Volume Resistivity

Mohm/cm

1.0 x 108

IPC-650 2.5.17.1 (After Humidity)

Mechanical Properties

Flexural Strength (MD)

psi (N/mm2)

10000 (69)

IPC-650 2.4.4

Flexural Strength (CD)

psi (N/mm2)

9000 (62)

IPC-650 2.4.4

Tensile Strength (MD)

psi (N/mm2)

9000 (62)

IPC-650 2.4.19

Tensile Strength (CD)

psi (N/mm2)

7000 (48)

IPC-650 2.4.19

Young’s Modulus (MD)

kpsi (N/mm2)

721 (4971)

ASTM D 3039/IPC-TM-650 2.4.19

Poisson’s Ratio (MD)

 

0.155

ASTM D 3039/IPC-TM-650 2.4.19

Dimensional Stability (MD)

mils/in

0.01

IPC-650 2.4.39 Sec. 5.4 (After Bake)

Dimensional Stability (CD)

mils/in

0.69

IPC-650 2.4.39 Sec. 5.4 (After Bake)

Dimensional Stability (MD)

mils/in

0.06

IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)

Dimensional Stability (CD)

mils/in

0.8

IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)

Thermal Properties

Thermal Conductivity (Unclad)

W/M*K

0.9

IPC-650 2.4.50

Thermal Conductivity (CH/CH)

W/M*K

1

IPC-650 2.4.50

Thermal Conductivity (C1/C1)

W/M*K

1.05

IPC-650 2.4.50

TCDk

ppm/°C

-3.581

 

CTE (X, Y axis)

ppm/°C

9.9

IPC-650 2.4.41 (RT- 150 °C)

CTE (Z axis)

ppm/°C

40

IPC-650 2.4.41 (RT- 150 °C)

Physical Properties

Moisture Absorption

%

0.03

IPC-650 2.6.2.1

Peel Strength (1 oz. ED)

lbs/in (N/mm)

8 (1.43)

IPC-650 2.4.8

Density (Specific Gravity)

g/cm3

2.84

IPC-650 2.3.5

Specific Heat

J/gK

0.94

IPC-650 2.4.50

Td (2% Wt. Loss)

°C (°F)

500 (930)

IPC - 650 2.4.24.6 / TGA

Td (5% Wt. Loss)

°C (°F)

515 (960)

IPC - 650 2.4.24.6 / TGA

Flammability Rating

 

V-0

UL 94

 

 

A Piece of RF-60TC Laminate

 

On the screen is a type of double sided RF-60TC PCB substrates .

 

Taconic RF-60TC PCB materials are utilized in many fields like dividers,High Power Amplifiers, Miniaturized Antennas, GPS, Patch, RFID reader, Filters, Couplers and Satellites etc

 

 

 

Conclusion

 

Taconic RF-60TC is a collection of mechanically supported, high thermal conductivity laminates that give 3 to 5 times the thermal conductivity of FR-4 based alternatives.

 

OK. This concludes the episode. Thank you for reading. See you next time.