Taconic RF-60A High Frequency PCB Material Introduction RF-60A is an organic-ceramic laminate in the ORganic CERamic(ORCER) family of Taconic products. Taconic RF-60A PCB is based on woven glass reinforcement. It is a result of Taconic's expertise in both ceramic fill technology and in coated PTFE fiberglass. Taconic RF-60A PCB exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties. Taconic RF-60A PCB's woven glass reinforcement ensures excellent dimentional stability and enhances flexural strength. It exhibits low Z-axis expansion allowing for plated-through-hole reliablity in extreme thermal environments. With a dielectric constant of approximately 6.15, it is ideal high DK products for applications requiring reduced circuit size and weight. The low electrical loss factor makes it an excellent selection for RF circuits. RF-60A laminates are in complete compliance with RoHS and WEEE directives and are compatible with the temperatures required for the new lead free solders. They can be sheared, drilled, milled and plated using standard methods for PTFE-woven fiberglass materials, so mass production becomes possible. Benefits (in general): Low Moisture Absorption Stable DK over Frequency Dimensionally Stable Low Z-axis Expansion High Flexural Strength Exceptional Interlaminar Bonds Typical Applications: Power Amplifiers Filters & Couplers Passive Components Antennas Our PCB Capabilities (RF-60A) PCB Material: Organic-ceramic Woven Fiberglass Reinforced Laminates Designation: RF-60A Dielectric constant: 6.15 ±0.25 Dissipation Factor DF 0.0038@10 GHz Thermal Conductivity 0.4 W/MK Layer count: Double Layer, Multilayer, Hybrid PCB Copper weight: 0.5oz (17 μm), 1oz (35μm), 2oz (70μm) Laminate thickness: 10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..
Data Sheet of Taconic RF-60A
Property |
Test Method |
Unit |
Value |
Unit |
Value |
Dk @ 10 GHz |
IPC-650 2.5.5.6 |
|
6.15 |
|
6.15 |
Df @ 10 GHz |
IPC-650 2.5.5.5.1 |
|
0.0038 |
|
0.0038 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
53 |
kV |
53 |
Dielectric Strength |
ASTM D 149 |
V/mil |
880 |
kV/mm |
35 |
Volume Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm/cm |
9.0 x 10^8 |
Mohm/cm |
9.0 x 10^8 |
Surface Resistivity |
IPC-650 2.5.17.1 (After Humidity) |
Mohm |
2.28 x 10^8 |
Mohm |
2.28 x 10^8 |
Arc Resistance |
IPC-650 2.5.1 |
Seconds |
193 |
Seconds |
193 |
Flexural Strength (MD) |
ASTM D 790 |
psi |
18,300 |
N/mm2 |
126.2 |
Flexural Strength (CD) |
ASTM D 790 |
psi |
14,600 |
N/mm2 |
100.7 |
Tensile Strength (MD) |
ASTM D 3039 |
psi |
19,500 |
N/mm2 |
134.4 |
Tensile Strength (CD) |
ASTM D 3039 |
psi |
16,300 |
N/mm2 |
112.4 |
Young’s Modulus |
ASTM D 3039 |
kpsi |
1,590 |
N/mm2 |
11,000 |
Poisson’s Ratio |
ASTM D 3039 |
|
0.068 |
N/mm2 |
0.068 |
Compressive Modulus |
ASTM D 695 (23°C) |
kpsi |
338 |
|
2,330 |
Peel Strength (1 oz. ED) |
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) |
lbs/in |
8 |
N/mm |
1.4 |
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
0.68 |
mm/M |
0.68 |
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in |
1.05 |
mm/M |
1.05 |
Density (Specific Gravity) |
ASTM D 792 |
g/cm3 |
2.79 |
g/cm3 |
2.79 |
Thermal Conductivity |
ASTM F 433 |
W/M*K |
0.4 |
W/M*K |
0.4 |
CTE (X axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
9 |
ppm/°C |
9 |
CTE (Y axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
8 |
ppm/°C |
8 |
CTE (Z axis) |
ASTM D 3386 (-30°C - 125°C) |
ppm/°C |
69 |
ppm/°C |
69 |
Outgassing (% TML) |
ASTM E 595* |
% |
0.02 |
% |
0.02 |
Outgassing (% CVCM) |
ASTM E 595* |
% |
0.00 |
% |
0.00 |
Outgassing (% WVR) |
ASTM E 595* |
% |
0.01 |
% |
0.01 |
Flammability Rating |
UL 94 |
|
V-0 |
|
V-0 |
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