PCB SIZE	51 x 52mm=1PCS
BOARD TYPE
Number of Layers	Double sided Ceramic PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)
	AlN Ceramic -0.39mm
	copper ------- 35um(1oz)
	----Prepreg----
	copper ------- 35um(1oz)
	AlN Ceramic -0.39mm
	copper ------- 35um(1oz)
	----Prepreg----
	copper ------- 35um(1oz)
	AlN Ceramic -0.39mm
	copper ------- 35um(1oz)
TECHNOLOGY
Minimum Trace and Space:	5mil / 5mil
Minimum / Maximum Holes:	0.4mm / 1.0mm
Number of Different Holes:	8
Number of Drill Holes:	31
Number of Milled Slots:	0
Number of Internal Cutouts:	1
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	AIN Ceramic
Final foil external:	1.0 oz
Final foil internal:	1.0 oz
Final height of PCB:	1.5 mm ±0.15mm
PLATING AND COATING
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Solder Mask Apply To:	NO
Solder Mask Color:	NO
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	N/A
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	94 V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"" (0.15mm)
Board plating:	0.0030"" (0.076mm)
Drill tolerance:	0.002"" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.Ceramic Parameters					2. Material Thickness
Items	Unit	Al2O3	Si3N4				Copper Thickness
Density	g/cm3	≥3.3	≥3.22				0.15mm	0.25mm	0.30mm	0.50mm	0.8mm
Roughness (Ra)	μm	≤0.6	≤0.7		Ceramic Thickness	0.25mm	Si3N4	Si3N4	Si3N4	Si3N4	-
Bending strength	Mpa	≥450	≥700			0.32mm	Si3N4	Si3N4	Si3N4	Si3N4	Si3N4
Coefficient of thermal expansion	10^-6/K	4.6~5.2 (40-400℃)	2.5~3.1 (40-400℃)			0.38mm	AlN	AlN	AlN	-	-
Thermal conductivity	W/(m*K)	≥170 (25℃)	80 (25℃)			0.50mm	AlN	AlN	AlN	-	-
Dielectric constant	1MHz	9	9			0.63mm	AlN	AlN	AlN	-	-
Dielectric loss	1MHz	2*10^-4	2*10^-4			1.00mm	AlN	AlN	AlN	-	-
Volume resistivity	Ω*cm	>10^14 （25℃)	>10^14 （25℃)
Dielectric strength	kV/mm	>20	>15

Introduction to AlN Ceramic Substrates​

Aluminum Nitride (AlN) Ceramic Copper Clad Laminate—commonly referred to as AlN copper clad laminate—is a specialized electronic material. It consists of an aluminum nitride (AlN) ceramic substrate with a high-purity copper layer bonded to its surface. This material integrates three key advantages: the ultra-high thermal conductivity of AlN ceramic, excellent electrical insulation, and the superior electrical conductivity of metallic copper. As a result, it has become a core material in fields such as high-power electronic devices, high-frequency communications, and new energy vehicles, and is widely recognized as the "ultimate solution to heat dissipation challenges in the electronics industry."​

 

Features & Benefits​

1. Ultra-High Thermal Conductivity​

The thermal conductivity of AlN reaches 170–200 W/(m·K)—8 to 10 times that of traditional aluminum oxide (Al₂O₃) ceramic. This exceptional thermal performance enables rapid transfer of heat generated by electronic components to the heat dissipation system, significantly lowering the chip junction temperature. In turn, this improves the reliability of equipment and extends its service life, addressing a critical pain point in high-power electronic applications.​

 

2. Low Thermal Expansion Coefficient (CTE) – Matched to Semiconductor Materials​

AlN has a CTE of 4.5×10⁻⁶/℃, which is highly compatible with semiconductor materials like silicon (Si) and silicon carbide (SiC). This close matching minimizes thermal stress between the substrate and semiconductor chips during thermal cycling, greatly reducing the risk of stress-induced cracking. This makes AlN ceramic substrates ideal for high-temperature and high-power scenarios where thermal stability is paramount.​

 

3. Excellent Electrical Insulation & High-Frequency Performance​

AlN exhibits a low dielectric constant (8.8–9.5) and extremely low dielectric loss (<0.001). These properties effectively reduce signal delay and energy loss during high-frequency signal transmission, ensuring signal integrity even in high-speed communication systems. Consequently, it has become an ideal choice for high-frequency devices such as 5G base stations and millimeter-wave radars.​

 

4. High Mechanical Strength & Corrosion Resistance​

AlN ceramic boasts high hardness and strong chemical stability. When combined with advanced copper cladding processes—such as Direct Bonding of Copper (DBC) or Active Metal Brazing (AMB)—it forms a tight, durable bond between the copper layer and the ceramic substrate. The resulting material is resistant to high temperatures and corrosion, enabling long-term stable operation in harsh environments (e.g., high humidity, chemical exposure, or extreme temperature fluctuations).​

 

Typical Applications​

1. Electric Vehicle Inverters​

In electric vehicle inverters, a 1mm-thick AlN substrate serves as the heat dissipation carrier for IGBT modules. This application reduces the operating temperature of the module by 20–30℃, directly enhancing the inverter’s energy conversion efficiency and extending the overall service life of the power system.​

 

2. GaN Power Amplifier Modules in 5G Base Stations​

GaN power amplifiers in 5G base stations generate significant heat during high-frequency operation, which can disrupt signal stability. AlN substrates address this challenge by efficiently dissipating heat, while their low dielectric loss ensures minimal signal interference—critical for maintaining the performance of 5G communication networks.​

 

3. Industrial Laser Cutting Machines​

In industrial CO₂ laser cutting machines, AlN substrates are used for heat dissipation of the laser’s drive circuit. By preventing excessive temperature rise in the circuit, they avoid beam drift caused by thermal deformation, ensuring the precision and consistency of laser cutting operations.​

 

Future Trends​

With the widespread adoption of third-generation semiconductors (e.g., SiC, GaN), the demand for efficient heat dissipation solutions in high-power-density devices has grown exponentially. AlN ceramic circuit boards are poised to expand their application scope in the following key fields:​

 

New Energy Sector: They will be increasingly used in photovoltaic inverters and energy storage systems, where reliable heat management is essential for optimizing energy efficiency and system longevity.​

 

Artificial Intelligence (AI): As AI chips grow in power density, AlN substrates will serve as high-performance heat dissipation carrier boards, supporting the stable operation of AI servers and computing clusters.​

 

6G Communications: For terahertz-frequency band circuits—critical for 6G technology—AlN substrates will act as core substrate materials, leveraging their low dielectric loss and high thermal conductivity to ensure signal integrity and thermal stability.​