Active Metal Brazing (AMB) Technology

The AMB (Active Metal Brazing) process is a method that utilizes a small amount of active elements (e.g., titanium, Ti) contained in the brazing filler metal. These elements react with the ceramic surface to generate a reaction layer, which enables wetting and soldering by the liquid brazing filler metal—thus achieving a stable bond between ceramic and metal components.

Si₃N₄ (Silicon Nitride) Ceramic Substrates

Si₃N₄ ceramic substrates are advanced materials renowned for their exceptional mechanical, thermal, and electrical properties, making them ideal for high-performance applications across industries.

These ceramic substrates offer full customization to meet specific customer requirements, including tailored ceramic thickness, copper layer thickness, and surface treatment options.

Their low coefficient of thermal expansion (CTE) ranges from 2.5 to 3.1 ppm/K (40-400°C), which closely matches that of silicon and other semiconductor materials. This minimizes thermal stress in electronic devices, ensuring long-term operational stability. With a thermal conductivity of 80 W/(m·K) at 25°C, they enable efficient heat dissipation, making them suitable for high-power and high-temperature operating environments.

Si₃N₄ ceramics boast an impressive bending strength of ≥700 MPa, providing exceptional mechanical durability for demanding applications. They support the brazing of copper layers thicker than 0.8mm, which reduces thermal resistance and enables the handling of high current loads. Additionally, these substrates feature selective Ag plating and sintered Ag processes, ensuring perfect compatibility with SiC chips for optimal performance.

Our PCB Processing Capability

We can process precision circuits with a line width/space of 3mil/3mil and a conductor thickness ranging from 0.5oz to 14oz. We also possess advanced processing capabilities, including micro-via filling, inorganic dam processing, and 3D circuit fabrication, to address complex design requirements.

We can handle a variety of substrate thicknesses, such as 0.25mm, 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, and 3.0mm, to diverse application scenarios.

We offer diversified surface treatment solutions, including the Electroplated Gold Process (1-30u"), Electroless Nickel Palladium Immersion Gold Process (1-5u"), Electroplated Silver Process (3-30μm), Electroplated Nickel Process (3-10μm), and Immersion Tin Process (1-3μm), to enhance PCB performance and reliability.