Home - Antenna PCB - Rogers IsoClad 917 High Frequency PCB Rogers non-woven fiberglass/PTFE PCB Materials for Antennas Application

Rogers IsoClad 917 High Frequency PCB Rogers non-woven fiberglass/PTFE PCB Materials for Antennas Application

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Brief Introduction

Rogers IsoClad 917 PCBs are non-woven fiberglass/polytetrafluoroethylene (PTFE) composite materials. To deliver an ultra-low dielectric constant—either 2.17 or 2.20—and a dissipation factor of 0.0013, these laminates utilize a low-proportion fiberglass-to-PTFE ratio.

 

A key advantage of  IsoClad 917 laminate lies in its material and manufacturing design: it incorporates longer random fibers, paired with a proprietary production process. This combination enables the laminate to outperform competitors in the same product class, offering superior dimensional stability and more consistent dielectric constant across the material.

 

As a non-woven fiberglass-reinforced solution, IsoClad 917 PCB is less rigid compared to woven fiberglass-based laminates. This inherent flexibility makes it ideal for applications where the final printed circuit board (PCB) requires shaping or bending—such as in conformal antennas and wrap-around antennas.

RO4003C PCB 板材外观

 

Features

  1. Low dielectric constant (Dk) of 2.17 or 2.20

2. Low dissipation factor of .0013 at 10GHz

3. Extremely low loss

4. Low moisture absorption

5. Highly Isotropic in X, Y and Z Directions

 

Typical Applications:

  1. Conformal Antennas

2. Stripline and Microstrip Circuits

3. Guidance Systems

4. Radar Systems

 

Our PCB Capability (IsoClad 917)

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PCB Capability (IsoClad 917)
PCB Material: Non-woven Fiberglass / PTFE Composites
Designation: IsoClad 917
Dielectric constant: 2.17 or 2.20 (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: ENIG(immersion gold), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..

 

RO4003C 图2

 

Appendix: Typical Values of IsoClad 917

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Typical Properties: IsoClad 917
Property IsoClad 917 Condition Test Method
Dielectric Constant @ 10 GHz 2.17, 2.20 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Thermal Coefficient of Er (ppm/°C) -157 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Peel Strength (lbs.per inch) 10 After Thermal IPC TM-650 2.4.8
Volume Resistivity (MΩ-cm) 1.5 x 10 10 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 1.0 x 10 9 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance (seconds) >180 D48/50 ASTM D-495
Tensile Modulus (kpsi) 133, 120 A, 23°C ASTM D-638
Tensile Strength (kpsi) 4.3, 3.8 A, 23°C ASTM D-882
Compressive Modulus (kpsi) 182 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 213 A, 23°C ASTM D-790
Dielectric Breakdown (kv) >45 D48/50 ASTM D-149
Density (g/cm3) 2.23 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.04 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Coefficient of Thermal 0°C to 100°C IPC TM-650 2.4.24
Expansion (ppm/°C) Mettler 3000
X Axis 46 Thermomechanical
Y Axis 47 Analyzer
Z Axis 236
Thermal Conductivity (W/mK) 0.263 100°C ASTM E-1225
Outgassing 125°C, ≤10-6 torr
Total Mass Loss (%) 0.02 Maximum 1.00%
Collected Volatile 0.00 Maximum 0.10%
Condensable Material (%)
Water Vapor Regain (%) 0.02
Visible Condensate (±) NO
Flammability Meets requirements of
UL94-V0
C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10