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Rogers high-frequency materials are specifically designed and produced by Rogers Corporation, a world-leading manufacturer of high-performance dielectrics, high-frequency laminates, and prepregs. The unique advantages of Rogers PCBs lie in their low dielectric constant and low loss characteristics, as well as their excellent thermal management capabilities and chemical resistance. Additionally, the design of Rogers PCBs allows for higher circuit density and more complex layouts, enabling engineers to integrate more functionality within a limited space. This makes them an ideal choice for high-performance electronic devices. For example，they are widely utilized in microwave and RF printed circuits and related applications in Aerospace & Defense, Wireless & Wireline (digital) Infrastructure, Automotive Radar Sensor, Satellite TV, Mobile Internet Device and High End Chip Scale Packaging. |
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| Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas |
Rogers RO3210 high-frequency circuit materials are ceramic-filled laminates with woven fiberglass, offering excellent electrical performance and mechanical stability. They feature smooth surfaces akin to non-woven PTFE laminates and can be processed using standard PTFE techniques for mass production at competitive prices. The substrate has a dielectric constant of 10.2 and a dissipation factor of 0.0027. |
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Rogers 3210 RF PCBs |
50 Mil Rogers 3210 PCBs |
Rogers 3210 Laminates |
Rogers 3210 Immersion Gold |
Ro3210 PCB Board |
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| Rogers PCB Built on RT/duroid 6002 20mil 0.508mm DK2.94 With HASL Lead Free for Ground Based and Airborne Radar Systems |
| Rogers RT/duroid 6002 Laminate is a low loss, low dielectric constant microwave material that maintains thermal stability from -55℃ to +150℃, ensuring reliable performance in complex microwave structures. With a low Z-axis CTE, it supports plated through hole reliability, enduring over 5,000 temperature cycles without failures, while its excellent dimensional stability and low tensile modulus enhance solder joint reliability, making it ideal for antennas and aerospace applications. |
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2-Layer RT/duroid 6002 PCB |
low CTE RT/duroid 6002 Substrate |
low TCDK Material |
RT/duroid 6002 Loss Tangent |
RT/duroid 6002 High Frequency PCB |
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| Rogers HF PCB in RT/Duroid 6002 for GPS Antennas: 30mil Thickness, DK2.94, Immersion Gold Surface Finish |
| Rogers RT/duroid 6002 PCB combines low loss tangent and low DK, providing essential properties for reliable microwave structures with a stable dielectric coefficient from -55℃ to +150℃. Its low Z-axis CTE ensures reliable plated through holes, having successfully completed over 5,000 temperature cycles, and its excellent dimensional stability enhances solder joint reliability, making it well-suited for antennas and aerospace designs. |
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| Roger 6002 PCB Thickness |
Immersion Gold PCB |
30mil 6002 Printed Circuit Board |
RT/Duroid 6002 Data Sheet |
RT/Duroid 6002 Dielectric Constant |
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| Rogers RO4730G3 High Frequency PCB 2-Layer Rogers 4730 20mil 0.508mm Printed Circuit Board DK3.0 DF 0.0028 Microwave PCB |
| RO4730G3 PCB offers a low-cost alternative to PTFE-based laminates, with a dielectric constant of 3.0 and loss tangent of 0.0022 at 2.5 GHz. It delivers high gain, low signal loss, and PIM values better than -160dBc. Compatible with standard epoxy and lead-free processes, it eliminates special treatments. With a Tg >280°C, it ensures excellent thermal stability and reliability, ideal for cellular base station antennas. |
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| Rogers RO4730 PCB Board |
Rogers RO4730G3 PCB Materials |
RO4730G3 PCB Circuit Board |
Rogers RO4730G3 Datasheet |
RO4730G3 20mil PCB |
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| 60mil RO4350B and 6.6mil RO4350B 3-Layer High-Frequency PCB with ENIG Finish: Optimize Your Wireless Systems |
Our multilayer high-frequency PCBs are built entirely with Rogers RO4350B materials—cores, prepreg, and adhesives—ensuring consistent performance at 10GHz+. The 4-layer design uses two RO4350B cores for superior signal integrity, while the 3-layer variant features two cores with one etched copper layer for compact, thermally stable designs. With 8 core thickness options (4mil/0.101mm to 60mil/1.524mm), these PCBs deliver unmatched flexibility for 5G, aerospace, and automotive radar applications. |
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Multilayer High-frequency PCB |
Rogers RO4350B Datasheet |
Rogers RO4350B Material |
4-layer RogersRO4350B PCB |
RO4350B Immersion Gold PCB |
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| 1.0mm-4-Layer-Mixed-Hybrid-PCB-with-High-Quality-4mil-Rogers-RO4350B-and-0.3mm-High-Tg-FR-4 |
| This 4-layer high-frequency PCB combines 4mil RO4350B and FR-4 materials, offering a simple and cost-effective solution ideal for entering new markets. The RO4350B hybrid PCB is widely used in applications such as preamplifiers, radar sensors, digital transmitters, and splitter modules; GPS antennas, communication relays, analog transmitters, and 4G antennas; as well as RF transmitters, WiFi amplifiers, RFID systems, and attenuators. |
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Rogers RO4350B Substrate |
Rogers RO4350B for Sale |
4mil RO4350B Thickness |
RO4350B Loss Tangent |
RO4350B Hybrid PCB |
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| 10mil-0.254mm-2-Layer-Rogers-RO3010-High-Frequency-PCB-with-DK10.2-and-DF-0.0022-High-Performance-Microwave-PCB |
| Rogers RO3010 high-frequency materials are ceramic-filled PTFE composites for microwave and RF applications, offering excellent electrical and mechanical stability. With a CTE of 17 ppm/℃ (X/Y) matching copper, they ensure dimensional stability and less than 0.5 mils/inch etch shrinkage. The Z-axis CTE of 24 ppm/℃ provides reliable plated through-hole performance in harsh environments. |
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RO3010 PCB 10mil |
Rogers RO3010 PCB |
Rogers 3010 Price |
RO3010 High Frequency PCB |
2-Layer 10mil RO3010 PCB |
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| DK4.5-60mil-1.524mm-TMM4-High-Frequency-PCB--Double-layer-Rogers-RF-PCB-with-Immersion-Gold-for-Antennas |
| This product is a double-layer RF PCB constructed on a Rogers TMM4 substrate with a thickness of 60mil. The board features a single NPTH (non-plated through hole) and utilizes 0.5oz base copper, which is plated up to 1oz for enhanced conductivity. The surface finish on the pads is immersion gold, while the board does not include solder mask or silkscreen printing for a clean, minimalist design. |
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2-Layer Rogers RF PCB |
Rogers TMM4 Laminate |
TMM4 High-Frequency PCB |
60mil 1.524mm TMM4 PCB |
TMM4 Antennas PCB |
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| 12mil-Rogers-RO4360G2-RF-PCB-Double-Sided-High-Frequency-PCB-with-Immersion-Gold-for- Base-Station-Power-Amplifiers |
| RO4360G2 PCBs from Rogers Corporation are high-performance, low-loss materials with a dielectric constant of 6.15. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials strike an ideal balance between performance and ease of processing. Designed to support lead-free manufacturing, RO4360G2 laminates offer enhanced rigidity, making them easier to handle in multi-layer board constructions while reducing material and fabrication costs. |
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Rogers 4360 High Frequency PCB |
Double Sided Rogers 4360 PCB |
12 Mil Rogers 4360 Substrates |
2-Layer RO4360G2 PCB Laminate |
Rogers 4360G2 Material |
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| Rogers-4360G2-High-Frequency-PCB-2-Layer-16mil-RF-PCB-with-Green-Mask-and-Immersion-Gold-for-Small-Cell-Transceivers |
| Rogers RO4360G2 PCBs are advanced, low-loss materials featuring a dielectric constant (Dk) of 6.15. These thermoset materials, reinforced with glass and filled with hydrocarbon ceramic, provide an optimal blend of high performance and processing simplicity. Engineered to support lead-free manufacturing processes, RO4360G2 laminates deliver improved rigidity, simplifying handling in multi-layer board designs and reducing both material and fabrication expenses. |
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Rogers 4360 Green Mask PCB |
Immersion-Gold Rogers 4360G2 PCB |
16 Mil Rogers 4360 Substrates |
Rogers 4360G2 Datasheet |
2-Layer RO4360G2 Laminate |
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