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Rogers RO4730G3 High Frequency PCB 2-Layer Rogers 4730 20mil 0.508mm Printed Circuit Board DK3.0 DF 0.0028 Microwave PCB |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO4730G3 laminates offer a reliable and low-cost solution for antenna designers, combining excellent mechanical and electrical properties. With a dielectric constant of 3.0 and a loss tangent of 0.0022 at 2.5 GHz (using LoPro Reverse Treated EDC foil), these materials enable high gain and minimal signal loss. RO4730G3 substrate also delivers low PIM performance, with values better than -160dBc.
Compatible with conventional epoxy and lead-free solder processes, Rogers RO4730G3 PCB eliminates the need for special treatments required by traditional PTFE-based laminates. Its high glass transition temperature (>280°C) ensures low Z-axis CTE, superior plated through-hole reliability, and excellent solder processability.
Ideal for cellular base station antennas, RO4730G3 high frequency PCB is a versatile choice for modern antenna design. |
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General description |
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This is a double - sided RF PCB constructed with 0.508mm (20mil) RO4730G3 material, designed specifically for use in Cellular Base Station Antenna PCBs. |
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Basic specifications |
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Base material: RO4730G3 20mil (0.508mm)
Dielectric constant: 3.0+/-0.5
Layer count: 2 layers
Type: Through holes
Format: 110mm x 50mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 0.60 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months |
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PCB Capability (RO4730G3) |
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PCB Capability (RO4730G3) |
PCB Material: |
Hydrocarbon ceramic woven glass |
Designator: |
RO4730G3 |
Dielectric constant: |
3.0 ±0.05 (process) |
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2.98 (design) |
Layer count: |
1-layer, 2-layer, Multi-layer, Hybrid configuration |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness (low profile copper): |
5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
Laminate thickness (ED Copper) |
20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc. |
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Rogers 4730 (RO4730G3) Data Sheet |
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RO4730G3 Typical Value |
Property |
RO4730G3 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.5 |
Z |
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10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.98 |
Z |
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1.7 GHz to 5 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0028 |
Z |
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10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
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2.5 GHz |
Thermal Coefficient of ε |
+34 |
Z |
ppm/℃ |
-50 ℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
<0.4 |
X, Y |
mm/m |
after etech +E2/150 ℃ |
IPC-TM-650 2.4.39A |
Volume Resistivity (0.030") |
9 X 107 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity (0.030") |
7.2 X 105 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
PIM |
-165 |
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dBc |
50 ohm 0.060" |
43 dBm 1900 MHz |
Electrical Strength (0.030") |
730 |
Z |
V/mil |
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IPC-TM-650 2.5.6.2 |
Flexural Strength MD |
181 (26.3) |
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Mpa (kpsi) |
RT |
ASTM D790 |
CMD |
139 (20.2) |
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Moisure Absorption |
0.093 |
- |
% |
48/50 |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Conductivity |
0.45 |
Z |
W/mK |
50℃ |
ASTM D5470 |
Coefficient of Thermal Expansion |
15.9
14.4
35.2 |
X
Y
Z |
ppm/℃ |
-50 ℃to 288℃ |
IPC-TM-650 2.4.4.1 |
Tg |
>280 |
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℃ |
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IPC-TM-650 2.4.24 |
Td |
411 |
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℃ |
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ASTM D3850 |
Density |
1.58 |
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gm/cm3 |
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ASTM D792 |
Copper Peel Stength |
4.1 |
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pli |
1oz,LoPro EDC |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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