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Rogers HF PCB in RT/Duroid 6002 for GPS Antennas: 30mil Thickness, DK2.94, Immersion Gold Surface Finish |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RT/duroid 6002 is the first microwave laminate to combine low loss and low dielectric constant, delivering outstanding electrical and mechanical properties crucial for designing complex microwave structures that are both reliable and stable. Its thermal coefficient of dielectric constant remains extremely low between -55℃ and +150℃, providing the electrical stability required by filter, oscillator, and delay line designers in today's high-demand applications.
With a low Z-axis coefficient of thermal expansion (CTE), this material ensures the reliability of plated through holes. It has successfully undergone over 5,000 temperature cycles (-55℃ to 125℃) without any failures in vias.
Dimensional stability is exceptional (0.2 to 0.5 mils/inch), achieved by matching the X and Y coefficients of expansion to those of copper, which often eliminates the need for double etching to maintain tight positional tolerances. The low tensile modulus (X,Y) reduces stress on solder joints and allows laminate expansion to be constrained by a minimal amount of low CTE metal (6 ppm/℃), further enhancing surface mount reliability.
Applications that benefit from the unique properties of RT/duroid 6002 include antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits in aerospace applications facing harsh environments. |
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Typical applications: |
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1. Airborne radar systems
2. Beam forming networks
3. Commercial airline collision avoidance
4. Global positioning systems antennas
5. Ground base systems
6. High reliability complex multi-layer circuits
7. Phased array antennas
8. Power backplanes |
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PCB Specifications |
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Rogers RT/Duroid 6002 30mil 0.762mm High Frequency PCB for Global Positioning System Antennas |
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PCB SIZE |
60 x 35 mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 6002 0.762mm |
copper ------- 18um(0.5 oz)+plate BOT layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.3mm / 1.0mm |
Number of Different Holes: |
no |
Number of Drill Holes: |
no |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RT/duroid 6002 0.762mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
0.8 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold (61.4% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: |
Top and Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 6002 (RT/duroid 6002) |
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RT/duroid 6002 Typical Value |
Property |
RT/duroid 6002 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.94±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.94 |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0012 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+12 |
Z |
ppm/℃ |
10 GHz 0℃-100℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
106 |
Z |
Mohm.cm |
A |
ASTM D 257 |
Surface Resistivity |
107 |
Z |
Mohm |
A |
ASTM D 257 |
Tensile Modulus |
828(120) |
X,Y |
MPa(kpsi) |
23℃ |
ASTM D 638 |
Ultimate Stress |
6.9(1.0) |
X,Y |
MPa(kpsi) |
Ultimate Strain |
7.3 |
X,Y |
% |
Compressive Modulus |
2482(360) |
Z |
MPa(kpsi) |
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ASTM D 638 |
Moisture Absorption |
0.02 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1
ASTM D 570 |
Thermal Conductivity |
0.6 |
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W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
16
16
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.1 |
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gm/cm3 |
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ASTM D 792 |
Specific Heat |
0.93(0.22) |
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j/g/k
(BTU/ib/OF) |
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Calculated |
Copper Peel |
8.9(1.6) |
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Ibs/in.(N/mm) |
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IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Hot Tags:
| Roger 6002 PCB Thickness |
Immersion Gold PCB |
30mil 6002 Printed Circuit Board |
RT/Duroid 6002 Data Sheet |
RT/Duroid 6002 Dielectric Constant |
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