Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG
 
 

 

  PCB Prototypes
 
  HDI PCB
   
  Rigid-flex PCB
   
  Multi-layer PCB
  High Speed PCB
   
  Low Loss PCB
   
  Hybrid PCB
   
  Rogers PCB
  Ceramic PCB
   
  Flexible Circuits
   
  F4B PCB
   
  Taconic PCB
   

 

 

 

 

   
   
10mil-0.254mm-2-Layer-Rogers-RO3010-High-Frequency-PCB-with-DK10.2-and-DF-0.0022-High-Performance-Microwave-PCB  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RO3010 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials provide outstanding electrical and mechanical stability while maintaining cost-effectiveness. Their consistent mechanical properties make them ideal for multi-layer board designs, eliminating issues such as warping or reliability concerns. RO3010 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes, closely matching that of copper. This ensures excellent dimensional stability, with typical post-etch and bake shrinkage of less than 0.5 mils per inch. Additionally, the Z-axis CTE of 24 ppm/℃ ensures superior plated through-hole reliability, even under harsh environmental conditions.

 
   
Typical applications:  

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 
   
 
   
PCB Specifications  

Rogers RO3010 10mil 0.254mm High Frequency PCB for Direct Broadcast Satellites

 

 

PCB SIZE

91 x 85mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3010 0.254mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 8 mil

Minimum / Maximum Holes:

0.4mm / 0.8mm

Number of Different Holes:

n/a

Number of Drill Holes:

n/a

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3010 0.254mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1mm

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

Bottom, 12micron Minimum

Solder Mask Color:

Green, PSR-2000GT600D, Taiyo Supplied.

Solder Mask Type:

LPSM

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Bottom

Colour of Component Legend

White, IJR-4000 MW300, Taiyo brand

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
   
Data Sheet of Rogers 3010 (RO3010)  

RO3010 Typical Value

Property

RO3010

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

10.2±0.05

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

11.2

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0022

Z

 

10 GHz/23

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-395

Z

ppm/

10 GHz -50to 150

IPC-TM-650 2.5.5.5

Dimensional Stability

0.35
0.31

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

105

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

105

 

COND A

IPC 2.5.17.1

Tensile Modulus

1902
1934

X
Y

MPa

23

ASTM D 638

Moisture Absorption

0.05

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.8

 

j/g/k

 

Calculated

Thermal Conductivity

0.95

 

W/M/K

50

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288)

13
11
16

X
Y
Z

ppm/

23/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

 TGA

 

ASTM D 3850

Density

2.8

 

gm/cm3

23

ASTM D 792

Copper Peel Stength

9.4

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 

 
   
   
   
Hot Tags:



RO3010 PCB 10mil

Rogers RO3010 PCB

Rogers 3010 Price

RO3010 High Frequency PCB

2-Layer 10mil RO3010 PCB

 

 

 

 

 
   
 
                                     
       
About Us
     
Products
       
Solutions
    Contact Us
       
     
       
   
 
             
       
Antenna, Mobile Internet
   
Address:
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
       
     
       
   
 
             
       
Wireless Infrastructure
   
Phone:
86-755-27374946
       
     
       
   
 
             
       
Millimeter Wave Radar
   
Email:
info@bicheng-enterprise.com
       
     
       
   
 
                         
Aerospace
     
WeChat:
bichengpcb
       
     
 
         
     
 
                         
Satellite Navigation
     
Skype:
vickyxie0315@outlook.com
       
     
 
         
     
 
                         
Power Amplifier
     
 
       
     
 
         
     
 
       
     
 
         
IoT
     
 
       
     
 
         
     
in fb yt quora

 

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved