|
|
|
|
|
|
|
|
|
10mil-0.254mm-2-Layer-Rogers-RO3010-High-Frequency-PCB-with-DK10.2-and-DF-0.0022-High-Performance-Microwave-PCB |
|
|
(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
|
|
|
|
|
Rogers RO3010 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials provide outstanding electrical and mechanical stability while maintaining cost-effectiveness. Their consistent mechanical properties make them ideal for multi-layer board designs, eliminating issues such as warping or reliability concerns. RO3010 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes, closely matching that of copper. This ensures excellent dimensional stability, with typical post-etch and bake shrinkage of less than 0.5 mils per inch. Additionally, the Z-axis CTE of 24 ppm/℃ ensures superior plated through-hole reliability, even under harsh environmental conditions. |
|
|
|
|
|
Typical applications: |
|
|
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
|
|
|
|
|
 |
|
|
|
|
|
PCB Specifications |
|
|
Rogers RO3010 10mil 0.254mm High Frequency PCB for Direct Broadcast Satellites |
|
|
PCB SIZE |
91 x 85mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3010 0.254mm |
copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
|
Minimum Trace and Space: |
4 mil / 8 mil |
Minimum / Maximum Holes: |
0.4mm / 0.8mm |
Number of Different Holes: |
n/a |
Number of Drill Holes: |
n/a |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO3010 0.254mm |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1mm |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Bottom |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
|
|
|
|
|
|
Data Sheet of Rogers 3010 (RO3010) |
|
|
RO3010 Typical Value |
Property |
RO3010 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
10.2±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
11.2 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0022 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-395 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.35
0.31 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1902
1934 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.05 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.8 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.95 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
13
11
16 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.8 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
9.4 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Hot Tags:
RO3010 PCB 10mil |
Rogers RO3010 PCB |
Rogers 3010 Price |
RO3010 High Frequency PCB |
2-Layer 10mil RO3010 PCB |
|
|
|