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Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, designed for outstanding electrical performance and mechanical stability. These laminates feature the surface smoothness of non-woven PTFE laminates. They can be processed into PCBs using standard PTFE manufacturing techniques, enabling mass production and competitive market pricing. The RO3210 substrate has a dielectric constant of 10.2 and a dissipation factor of 0.0027. |
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Typical applications:
1. Automotive collision avoidance systems
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellites
6. LMDS and wireless broadband
7. Microstrip patch antennas
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems |
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PCB Specifications |
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Rogers RO3210 50mil 1.27mm High Frequency PCB for Microstrip Patch Antennas |
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PCB SIZE |
102 x 102mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18µm(0.5 oz)+plate TOP layer |
RO3210 1.270mm |
copper ------- 18µm(0.5 oz)+plate BOT layer |
TECHNOLOGY |
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Minimum Trace and Space: |
6 mil / 4 mil |
Minimum / Maximum Holes: |
0.4 mm / 2.5 mm |
Number of Different Holes: |
8 |
Number of Drill Holes: |
32 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
NO |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3210 1.270mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
1.3 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3210 (RO3210) |
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Property |
Typical Value RO3210 |
Direction |
Unit |
Condition |
Test Method |
Dielectric Constant, er Process |
10.2± 0.50 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5
Clamped Stripline |
Dielectric Constant, er Design |
10.8 |
Z |
- |
8 GHz - 40 GHz |
Differential Phase Length Method |
Dissipation Factor, tan d |
0.0027 |
Z |
- |
10 GHz 23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er |
-459 |
Z |
ppm/°C |
10 GHz 0-100°C |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.8 |
X,Y |
mm/m |
COND A |
ASTM D257 |
Volume Resistivity |
103 |
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MW•cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
103 |
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MW |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
579
517 |
MD CMD |
kpsi |
23°C |
ASTM D638 |
Water Absorption |
<0.1 |
- |
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.79 |
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J/g/K |
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Calculated |
Thermal Conductivity |
0.81 |
- |
W/m/K |
80°C |
ASTM C518 |
Coefficient of Thermal Expansion (-55 to 288 °C) |
13
34 |
X,Y, Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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°C |
TGA |
ASTM D3850 |
Color |
Off White |
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Density |
3.0 |
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gm/cm3 |
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Copper Peel Strength |
11.0 |
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pli |
1 oz. EDC
After Solder Float |
IPC-TM-2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead Free Process Compatible |
YES |
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