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What is Tensile Strength in High Frequency PCB?

 
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    March 21. 2025    
         
    Tensile strength includes longitudinal tensile strength (MD) and transverse tensile strength (CD). Defined as the maximum stress a material can withstand under tensile forces. It affects mechanical stability and relates to reliability in high-frequency signal transmission.    
         
       
         
         
         
   

What is Electrical Strength in High Frequency PCB?

   
         
    March 20. 2025    
         
    In high-frequency PCB design, electrical strength is one of the crucial factors to ensure signal integrity and device reliability. Electrical strength refers to the ability of a material to resist electrical breakdown under specific conditions, directly affecting the performance and safety of the circuit.    
         
       
         
         
         
   

What is Dimensional Stability in High Frequency PCB ?

   
         
    March 19. 2025    
         
    Dimensional stability refers to the ability of a high frequency Printed Circuit Board (PCB) to maintain its original shape, size, and mechanical properties under various environmental conditions such as temperature changes, humidity fluctuations, and mechanical stress. It is a crucial characteristic that directly impacts the performance and reliability of the PCB.    
         
       
         
         
         
   

What is Td in High Frequency PCB ?

     
           
    March 18. 2025      
           
    In the scope of PCBs, Td (Decomposition Temperature) is defined as the temperature at which a material begins to decompose when heated. This is an important indicator of the thermal stability of PCB materials. When the temperature reaches Td, the chemical structure of the material starts to break down, releasing gases, and the material's performance sharply declines.      
           
         
           
           
           
   

What is Tg in High Frequency PCB ?

     
           
    March 13. 2025      
           
    In the field of PCBs, Tg (Glass Transition Temperature) denotes the temperature at which a material transitions from a glassy state to a rubbery state. At this temperature, the physical properties of the material undergo significant changes. In the glassy state, the material is hard and brittle; as the temperature rises above Tg, it begins to soften and exhibit rubber-like elasticity.      
           
         
           
           
           
   

What is SMT in High Frequency PCB ?

     
           
    March 11. 2025      
           
    In modern electronic devices, the design and manufacturing of high-frequency PCBs are crucial, and Surface Mount Technology (SMT) is key to enhancing high-frequency PCB performance. SMT is a technique that mounts electronic components directly on the surface of the PCB rather than through holes, which improves component density and electromagnetic compatibility, thereby enhancing the stability of high-frequency signal transmission.      
           
         
           
           
           
   

What is Hole Mounting in High Frequency PCB?

     
           
    March 7. 2025      
           
    In high-frequency PCB design, hole mounting refers to the process of creating and utilizing plated through-holes (PTH) or non-plated holes (NPTH) to mount components, establish electrical connections, or enhance mechanical stability. This process is not just a manufacturing step but a critical factor influencing the reliability, signal integrity, and performance of high-frequency circuits.      
           
         
           
           
           
   

What is Board Tooling Hole in High Frequency PCB ?

     
           
    March 5. 2025      
           
    In high frequency printed circuit boards, the board tooling hole is a specialized feature that plays a crucial role. Specifically, it is a hole created during the manufacturing process to aid in production flow and ensure precision and alignment. Though it may seem like a small detail, it has a significant impact on achieving excellent performance and quality.      
           
         
           
           
           
   

What is Buried Via Holes in High Frequency PCB?

     
           
    March 4. 2025      
           
    "Incorporating buried via holes into your PCB design can transform traditional circuit boards into powerful high-performance platforms." In high-frequency PCB design, buried via holes are the holes that connect different internal layers of the PCB without penetrating the entire board. In the pursuit of high-frequency performance, buried via holes are an indispensable design element      
           
         
           
           
           
   

What is a Blind Via Hole in High Frequency PCB?

     
           
    March 3. 2025      
           
   

In high-frequency PCB design, a blind via hole refers to a hole that only connects one side of the PCB, connecting from the outer layer to the inner layer, and does not penetrate the entire circuit board. "The smoothness of signal transmission often depends on the clever layout of blind via hole."

     
           
         
           
           
           
           
   

APR-2025

 

    FEB-2025

 

 

 
           
   
 
                                     
       
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