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    What is Tensile Strength in High Frequency PCB?      
   

1. Definition of Tensile Strength

 
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Tensile strength includes longitudinal tensile strength (MD) and transverse tensile strength (CD). Defined as the maximum stress a material can withstand under tensile forces. It affects mechanical stability and relates to reliability in high-frequency signal transmission. Measures a material's ability to resist fracture under tensile load, determining high-frequency PCB performance in extreme environments and ensuring stability in various application scenarios.

   
         
    2. Importance of Tensile Strength    
   

“Tensile strength is the touchstone of material toughness, determining the future of PCBs.” The transmission of high-frequency signals requires circuit boards to possess excellent mechanical properties to avoid signal distortion or disconnection due to material fatigue. Therefore, understanding and optimizing tensile strength is key to ensuring the reliability of PCBs.

   
         
   

3.Impact of Different Thicknesses on Tensile Strength

   
   

There are significant differences in tensile strength among high-frequency PCBs of varying thicknesses, primarily reflected in the following aspects:

 

   
         
   

3.1 PCB Thickness

   
   

Generally, an increase in PCB thickness leads to higher tensile strength. Thicker materials can better distribute the applied stress, thereby enhancing tensile resistance.

   
         
    3.2 Stress Distribution    
   

Thicker PCBs can distribute stress more evenly when subjected to force, reducing localized stress concentration, which helps improve overall mechanical performance and durability.

   
         
   

3.3 Effect of Coefficient of Thermal Expansion

   
   

The CTE of materials used in high-frequency PCBs can also affect tensile strength. Thicker PCBs typically exhibit better stability during thermal cycling, reducing deformation or fracture due to thermal stress.

 

   
         
    3.4 Manufacturing Processes    
   

Thicker PCBs may necessitate more complex lamination and drilling processes to ensure structural integrity,which can influence the final product's tensile strength.

In high-frequency applications, PCB thickness choice affects tensile strength and signal transmission stability and reliability. Designers must consider the balance between tensile strength and electrical performance when selecting PCB thickness.

   
         
    4. Improvement Measures    
   

First, select high-performance substrates, such as polyimide or glass fiber-reinforced resin; second, optimize manufacturing processes to ensure material uniformity and density; finally, implement strict quality control and tensile strength testing to ensure that each PCB meets design standards.

   
         
   

5. An Overview of Taconic TSM-DS3 PCB

   
   

When it comes to the tensile strength, I can't help but think of Taconic TSM-DS3 high-frequency PCB.

Taconic TSM-DS3 PCB is an excellent thermally stable, ceramic-filled reinforced material, with a dissipation factor of 0.0011 at 10 GHz. It has a glass fiber content of only 5%, high thermal conductivity of 0.65 W/m*K, and a low-loss core. Below are the advantages of TSM-DS3 in terms of tensile strength.

   
         
    5.1 High Tensile Strength    
   

The longitudinal tensile strength of  TSM-DS3 laminate can reach up to 7,030 N/mm², while the transverse tensile strength can reach 3,830 N/mm² (ASTM D 3039/IPC-650 2.4.19). This exceptional strength allows it to perform well under mechanical stress. Compared to many traditional PCB materials, TSM-DS3 offers higher tensile resistance, effectively preventing breakage or deformation in high-stress environments.

   
         
    5.2 Excellent Mechanical Stability    
   

The material structure of TSM-DS3 substrate is designed for good mechanical performance in high-temperature and high-humidity environments.

High tensile strength retention at elevated temperatures enables the circuit board to maintain integrity under extreme conditions.

   
         
    5.3 Low Coefficient of Thermal Expansion    
   

TSM-DS3 PCB has a low CTE, meaning that the material experiences minimal dimensional changes with temperature fluctuations. This reduces the risk of mechanical failure due to thermal stress and further enhances its tensile strength effectiveness.

   
         
    5-1. CTE of TSM-DS3 PCB    
   

Property

Test Method

Value

Unit

CTE (x axis) (RT to 125ºC)

IPC-650 2.4.41/TMA

10

ppm/ºC

CTE (y axis) (RT to 125ºC)

IPC-650 2.4.41/TMA

16

ppm/ºC

CTE (z axis) (RT to 125ºC)

IPC-650 2.4.41/TMA

23

ppm/ºC

   
         
    5.4 Chemical Resistance    
   

TSM-DS3 laminate has good chemical resistance, can resist erosion by multiple chemicals. Crucial in some applications. Helps maintain material's structural integrity and support tensile strength.

   
         
    6. Application Scenarios    
   

 TSM-DS3 high-frequency PCB can be used in high-power application fields that have high requirements for the thermal stability and mechanical strength of materials, such as couplers, phased array antennas, semiconductor/ATE testingradar manifolds, as well as in oil drilling and automotive industries.

   
         
       
         
    7. Conclusion    
   

“Optimizing tensile strength is a forward-looking investment in future technology.” By implementing effective measures, PCB manufacturers can enhance product quality and reliability in a competitive market, ensuring they stand out in high-frequency applications.

   
         
   

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !

 

Visit https://www.bicheng-enterprise.com to learn more.

Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com.

   
         
         
         
       
       
           
   
 
                                     
       
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