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    What is Td in High Frequency PCB ?      
   

1. Definition of Td

 
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In the scope of PCBs, Td (Decomposition Temperature) is defined as the temperature at which a material begins to decompose when heated. This is an important indicator of the thermal stability of PCB materials. When the temperature reaches Td, the chemical structure of the material starts to break down, releasing gases, and the material's performance sharply declines.

   
         
    2. Importance of High Td    
   

2.1 Safety Considerations

In some high-power electronic devices, PCBs can generate significant heat. If the material has a low Td, decomposition at high temperatures may produce flammable gases, increasing the risk of fire. For example, in the power modules of servers, the large amount of energy conversion generates heat; using PCB materials with a high Td can ensure that decomposition does not occur under normal operating temperatures, thereby enhancing the safety of the device.

   
         
   

2.2 Lifespan and Reliability

Materials with a low Td are prone to decomposition after prolonged exposure to heat, leading to a decline in PCB performance, such as reduced insulation properties and weakened adhesion of copper foil. Conversely, materials with a high Td can maintain stability in high-temperature environments for extended periods, thereby prolonging the lifespan of the PCB.

   
         
   

3. Application Case

   
   

In aerospace electronic devices, because these devices operate at high altitudes with relatively poor heat dissipation conditions and have extremely high reliability requirements, PCB materials used in such devices typically possess a high Td. This ensures that under complex thermal environments, the circuit boards can function normally without failure due to material decomposition.

   
         
    4. An Overview of RogersTMM 13i PCB    
   

When it comes to the Td of PCBs, I invariably think of Rogers TMM13i high-frequency PCB. The Td of TMM13i substrate reaches up to 425°C, demonstrating excellent thermal stability. Rogers TMM 13i thermoset microwave laminates are composed of ceramics, hydrocarbons and thermoset polymers, which are designed for stripline and microstrip applications with requirements for high-reliability plated through holes.

   
         
   

4-1. Rogers TMM 13i Thermoset Microwave Laminate

   
       
         
    4-2. Td of TMM13i vs. Other PCBs    
   

Comparison Object

Decomposition Temperature (°C)

Explanation

TMM13i PCB

425 (TGA)

It has a relatively high decomposition temperature itself and can work stably in higher temperature environments.

FR-4 and Other Traditional PCB Materials

About 300

TMM13i is about 125 °C higher than it.

TMM10 (in the same series)

Lower than 425

TMM13i has more prominent high-temperature stability in the same series.

RO3003, RO3006 (RO3000 Series)

350 - 380

TMM13i is 45 - 75 °C higher than them.

   
         
    Based on the table above, it can be seen that Rogers TMM13i PCB has many obvious advantages in terms of high Td . The details are as follows:    
         
   

4.1 Advantages of Rogers TMM13i laminate in High Td

   
   

High Temperature Stability

 

Rogers TMM13i's decomposition temperature is 425 °C, which is much higher than that of ordinary PCB materials. It can maintain a stable chemical structure and performance under high temperature conditions.

Its thermal expansion coefficient matches that of copper. It can avoid interlayer separation and warping when the temperature changes.

 

 

Electrical Properties

 

At 10 GHz, the dielectric constant of TMM13i laminate is 12.85 ± 0.35, and its thermal coefficient is -70 ppm/K. It can keep stable signal transmission.

At 10 GHz, its dissipation factor is 0.0019. It can minimize signal attenuation and loss.

 

 

Mechanical Properties

 

Rogers TMM13i PCB can resist creep and cold flow. It can maintain its shape and size accuracy under long-term high temperature.

It has good tolerance to processing chemicals during manufacturing.

 

 

Heat Dissipation

 

The thermal conductivity of TMM13i laminate is 0.76 W/(m·K).

It can conduct heat effectively and reduce the risk of local overheating. It can combine with various heat dissipation designs.

   
         
    5. Summary    
   

In conclusion, high decomposition temperature (Td) is crucial for PCB applications, providing essential thermal stability and reliability. As the saying goes, "Stability is the foundation of innovation." Prioritizing high Td materials ensures the longevity of advanced technologies.

   
         
   

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !

 

Visit https://www.bicheng-enterprise.com to learn more.

Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com.

   
         
         
         
       
       
           
   
 
                                     
       
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