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    What is Hole Mounting in High Frequency PCB?      
   

1. 1.Introduction to Hole Mounting

 
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IIn high-frequency PCB design, hole mounting refers to the process of creating and utilizing plated through-holes (PTH) or non-plated holes (NPTH) to mount components, establish electrical connections, or enhance mechanical stability. This process is not just a manufacturing step but a critical factor influencing the reliability, signal integrity, and performance of high-frequency circuits.

   
         
    2. Why is Hole Mounting Important    
   

High-frequency PCBs operate in a domain where even minor design flaws can cause issues like:

 

Signal distortion

Electromagnetic interference (EMI)

Impedance mismatches

 

Proper hole mounting ensures:

Robust electrical connections between layers

Minimal signal loss and interference

Mechanical stability for components under stress (e.g., thermal cycling, vibration)

By addressing these challenges, hole mounting becomes a key enabler for high-frequency PCB reliability.

   
         
   

3. Key Considerations for Hole Mounting

   
   

To optimize performance in high-frequency PCBs, designers must focus on:

 

Hole size and plating thickness: Ensures durability and conductivity.

Alignment and placement: Prevents signal disruption.

Thermal and EMI management: Reduces interference while ensuring heat dissipation.

Impedance control: Maintains signal integrity for high-frequency signals.

 

Reliable hole mounting forms the foundation of high-frequency PCB performance, ensuring efficient communication across PCB layers and mechanical stability.

   
         
    4. Advantages of RO4830 Laminates in Through-Hole Installation    
   

Rogers RO4830 laminates are thermoset materials with extremely low insertion loss, which is 2.2 dB/inch at 77 GHz. They possess a UL 94 V-0 flame retardant rating. Equipped with the optimized filler, resin and glass composite material system as well as the smooth LoPro® copper foil processed by inversion treatment, they are reliable in performance and cost-effective.They are Ideal for automotive radar sensor PCB applications.The RO4830laminates have obvious advantages in through-hole installation, as follows:

   
         
       
         
    4.1 Material Characteristic Advantages    
   

Rogers RO4830 high frequency PCBs , thermoset materials, are feature an optimized filler, resin, and glass composite material system. When combined with the smooth LoPro® copper foil processed by inversion treatment, they exhibit excellent oxidation resistance.

   
         
   

4.2 Laser Drilling Advantages

   
   

The RO4830 substrate has excellent laser drilling performance. The through-hole wall is smooth and has high dimensional accuracy. Compared with some traditional materials, after laser drilling of the RO4830laminates, the roughness of the through-hole can be reduced by about 30%, thus better ensuring the quality of subsequent processes such as electroplating.

   
         
    4.3 Stable Dielectric Constant    
   

The dielectric constant of the RO4830 is stable and consistent. The dielectric constant is 3.24 at 77 GHz, ensuring accurate transmission of high-frequency signals. When the signal is transmitted between different layers through the through-hole, the stable dielectric constant is like a stable "signal channel environment", which helps reduce signal distortion and improves the performance of the entire PCB in high-frequency applications.

   
         
   

4.4 Cost Advantage

   
    The RO4830 laminate reduces the overall cost of PCB manufacturing and reduces the reliance on special equipment and processes. Due to its material characteristics and good processing performance, in manufacturing links such as through-hole installation, it does not need to use complex through-hole pre-treatment or post-treatment processes like some high-performance but difficult-to-process materials, thus further reducing the overall cost of PCB manufacturing.    
         
    5. RO4830 Datasheet    
   

Designation:

RO4830

PCB Material:

Hydrocarbon/ Ceramic/ Spread Woven Glass

Dielectric constant:

3.24

Dissipation factor

0.0033-0.0032

Layer count:

Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

Dielectric thickness

5mil (0.127mm), 9.4mil (0.239mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.

 

   
   

6. Conclusion

   
    Hole mounting in high-frequency PCBs is not just about making connections—it’s about ensuring long-term reliability and performance. As the saying goes, “High frequency lets signals fly, but hole mounting ensures a smooth flight.”    
         
   

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !

 

Visit https://www.bicheng-enterprise.com to learn more.

Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com.

   
         
         
         
       
       
           
   
 
                                     
       
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