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1. Principal Introduction about Buried Via Holes

"Incorporating buried via holes into your PCB design can transform traditional circuit boards into powerful high-performance platforms." In high-frequency PCB design, buried via holes are the holes that connect different internal layers of the PCB without penetrating the entire board. In the pursuit of high-frequency performance, buried via holes are an indispensable design element. This design not only optimizes space layout but also significantly enhances signal integrity, ensuring smooth transmission of high-frequency signals.

Buried via holes effectively reduce signal loss and crosstalk, thereby enhancing electrical performance. This is particularly critical for high-frequency applications, as signal attenuation and distortion can directly impact performance at high frequencies. By strategically placing buried via holes, designers can minimize signal path lengths, ensuring rapid signal transmission.

Additionally, buried via holes play an important role in thermal management. They help dissipate heat, improving the overall thermal management capabilities of the PCB. This allows high-frequency circuits to maintain good performance under heavy loads, preventing failures due to overheating.

3. Application Examples

From my perspective，Taconic TLY-5 high frequency PCB stands out in the design of Buried Via Holes in high-frequency PCBs. Taconic LY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. Let us examine Taconic TLY-5 datasheet of Buried Via Holes design.

4.1 Very Low Dielectric Constant

The dielectric constant range of Taconic TLY-5 is 2.17 to 2.40, which reduces signal propagation speed and crosstalk. When designing buried via holes, this allows signals to transmit more quickly within the vias and between multilayer boards, improving signal transmission efficiency and meeting the circuit needs for high-frequency, high-speed, and high-capacity data transmission.

4.2 Low Dissipation Factor

The dissipation factor of Taconic TLY-5 substrate is very low at 0.0009 at 10 GHz, enabling successful deployment in automotive radar applications designed for 77 GHz and other antennas at millimeter wave frequencies. This further reduces signal energy loss when high-frequency signals are transmitted through buried via holes, ensuring signal strength and quality, and guaranteeing the reliability and stability of signal transmission.

4.3 High Copper Peel Strength

 The material has high copper peel strength, which ensures a good bond between the copper foil and the substrate during the processing of buried via holes and multilayer boards. This prevents copper foil delamination or peeling, enhancing the structural stability of the multilayer boards and the reliability of electrical connections.

• Automotive Radar
• Satellite/Cellular Communications
• Power Amplifiers
• LNBs, LNAs, LNCs
• Aerospace
• Ka, E and W band Applications

In high-frequency PCB design, the application of buried via holes provides engineers with greater design flexibility and improved electrical performance. Through effective layout of buried via holes, designers can ensure stable transmission of high-frequency signals, enhancing the overall reliability and performance of electronic products.

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with exceptional service. Feel free to consult and contant at any time !