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| High speed PCB |
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High speed PCBs are specialized circuit boards designed to handle high-frequency signals and fast data transmission. These PCBs are essential in modern electronic devices, particularly in telecommunications, computing, and consumer electronics, where rapid signal processing is crucial. One of the key characteristics of high-speed PCBs is their ability to minimize signal loss and electromagnetic interference. This is achieved by making use of advanced materials, for instance, low-loss dielectric substrates which help to maintain signal integrity when operating at high frequencies. Moreover, high-speed PCBs often incorporate techniques like controlled impedance, differential signaling and careful routing of traces that further enhance the board's ability to optimize performance and ensure efficient data transfer without compromising quality. |
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| Rogers RO3035 RF PCB 30mil 0.762mm Laminate 2-layer High Frequency Circuit Board with Low CTE |
Rogers RO3035 high - frequency materials are ceramic - filled PTFE composites for commercial microwave and RF. They offer outstanding electrical and mechanical stability at affordable prices. The consistent mechanical properties let designers create multi - layer boards free from warpage and reliability concerns. RO3035 PCB has a 17 ppm/℃ CTE in X and Y axes, like copper for dimensional stability. Etch shrinkage is generally less than 0.5 mils per inch after processing. The 24 ppm/℃ Z - axis CTE ensures high - reliability for plated through - holes even in difficult environments. |
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Rogers RO3035 Material |
Rogers RO3035 Datasheet |
Rogers RO3035 Price |
Rogers RO3035 PCB |
RO3035 Specifications |
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| 2-Layer 25mil 0.635mm Rogers 3006 High Frequency PCB Rogers RO3006 Microwave PCB DK6.15 DF 0.002 |
| Rogers RO3006, high - frequency materials, are ceramic - filled PTFE composites for commercial microwave and RF. They're designed to offer good stability at competitive prices. Their consistent properties let designers make multi - layer boards without warpage or reliability glitches. RO3006 has 17 ppm/℃ CTE in X and Y axes, matching copper, leading to good dimensional stability and less than 0.5 mils per inch etch shrinkage post - etch and bake. Its 24 ppm/℃ Z - axis CTE provides reliable plated through - holes in extreme environments. |
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Rogers RO3006 PCB |
Rogers 3006 RF microwave Circuit Board |
25mil Rogers RO3006 Material |
Low Dielectric Loss RO3006 |
Double Sided RO3006 Substrate |
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| RT/Duroid 6002 Rogers HF PCB: 60mil 1.524mm Thickness, DK2.94, Immersion Gold for Commercial Airline Collision Avoidance |
| Rogers RT/duroid 6002 PCB is a pioneering microwave material known for its low loss and dielectric constant, crucial for maintaining electrical stability from -55℃ to +150℃ in complex structures. Its low Z-axis CTE enhances the reliability of plated through holes, surviving over 5,000 temperature cycles, while its dimensional stability and low tensile modulus improve solder joint performance, making it ideal for antennas and aerospace applications. |
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60mil RT/Duroid 6002 PCB |
6002 High Frequency PCB |
Duroid 6002 Laminate |
6002 Loss Tangent |
Rogers 6002 Substrates |
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| 120mil 3.048mm Rogers HF PCB RT/Duroid 6002 DK2.94 With Immersion Gold for Power Backplanes |
| Rogers RT/duroid 6002 Substrate is a revolutionary microwave laminate offering low loss and low dielectric constant, vital for reliable microwave structures with a stable dielectric coefficient from -55℃ to +150℃. Its low Z-axis CTE ensures the reliability of plated through holes, having endured over 5,000 temperature cycles, and its excellent dimensional stability and low tensile modulus enhance solder joint reliability, making it perfect for antennas and aerospace designs. |
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2-Layer RT/duroid 6002 PCB |
low CTE RT/duroid 6002 Substrate |
RT/Duroid 6002 Low TCDK Material |
RT/duroid 6002 Loss Tangent |
RT/duroid 6002 High Frequency PCB |
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| 2-Layer Rogers 4730 30mil 0.762mm Circuit Board Rogers RO4730G3 Microwave PCB Board DK3.0 DF0.0028 High Frequency PCB |
Rogers RO4730G3 High Frequency PCB is a low-cost alternative to PTFE, with Dk 3.0 and Df 0.0022 at 2.5 GHz. It enables high gain, low loss, and PIM <-160dBc. Compatible with standard processes, Rogers 4730 simplifies manufacturing. With Tg >280°C, RO4730G3 Microwave PCB offers excellent thermal performance, ideal for cellular base station antennas. |
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| Rogers RO4730 PCB Board |
Rogers RO4730G3 PCB Materials |
RO4730G3 PCB Circuit Board |
Rogers RO4730G3 Datasheet |
RO4730G3 30Mil PCB |
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| 6.6 Mil RO4350B and 20 Mil RO4350B 4-Layer High-Frequency PCB with Blind Vias--Precision Engineered for Radar Sensors |
| Looking for a PCB solution that combines performance, flexibility, and reliability? Our multilayer high-frequency PCBs are made exclusively with premium materials, including RO4350B substrates and prepreg adhesives, ensuring top-tier quality for your most demanding applications. Take, for example, our 4-layer RO4350B PCB—constructed with 2 cores of RO4350B substrates, it’s engineered to deliver unmatched performance. |
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RO4350B High-frequency PCB |
20Mil Rogers RO4350B |
Rogers RO4350B Price |
4-layer Rogers RO4350B PCB |
RO4350B Immersion Gold PCB |
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| Double-Layer-Rogers-RO3010-0.635mm-25mil-Microwave-PCB-Board-for-High-Efficiency-Microwave-and-RF-Solutions |
| Rogers RO3010 materials are ceramic-filled PTFE composites designed for microwave and RF applications, delivering stable electrical and mechanical performance. Their CTE of 17 ppm/℃ (X/Y) aligns with copper, ensuring minimal shrinkage (<0.5 mils/inch). A Z-axis CTE of 24 ppm/℃ enhances through-hole reliability in demanding conditions. |
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25mil RO3010 PCB |
Rogers RO3010 Laminate |
Rogers 3010 Datasheet |
RO3010 Low CTE PCB |
2-Layer RO3010 PCB |
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| 0.762mm-30mil-Taconic-TLF-35-RF-PCB-High-Frequency-Microwave-Circuit-Board-with-OSP-and-Low-Dielectric-Constant-3.5 |
| TLF-35A is a low-cost RF material ideal for high-volume commercial microwave and radio frequency applications. It offers exceptional peel strength for 1/2 oz and 1 oz copper, outperforming standard epoxy materials, and features ultra-low moisture absorption, low dissipation factor (0.002), and a dielectric constant of 3.5 +/-0.05. Its woven fabric design ensures dimensional stability, and it meets V-0 flammability ratings per IPC-TM-650 standards, making it a reliable choice for high-frequency designs. |
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Taconic TLF-35 Low Cost PCB |
30mil TLF-35 RF PCB |
2 layers Taconic TLF-35 PCB |
Taconic TLF-35 Microwave PCB |
TLF-35 OSP Finished PCB |
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| RO4360G2-RF-PCB-20mil-Double-Sided-High-Frequency-Laminate-with-Immersion-Gold-for-Patch-Antennas-From-Rogers |
| Rogers RO4360G2 PCBs are advanced, low-loss materials with a dielectric constant (Dk) of 6.15. These thermoset materials, reinforced with glass and filled with hydrocarbon ceramic, deliver an optimal combination of performance and processability. RO4360G2 laminates are lead-free compatible and provide improved rigidity, simplifying multi-layer board fabrication and reducing overall costs. |
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20mil Rogers RO4360G2 Thickness |
Rogers RO4360G2 Price |
RO4360G2 Online Purchase |
Rogers RO4360 Substrate |
Rogers 4360G2 Material |
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| 2-Layer-RO4360-High-Frequency-PCB-24mil-Rogers-RF-Circuit-Board-With-Immersion-Gold-for-Ground-based-Radar |
| Processing similarly to FR-4, Rogers RO4360G2 laminates are compatible with automated assembly and feature a low Z-axis CTE for enhanced design flexibility. They share the high Tg characteristic of the RO4000 series and can be used alongside RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs. |
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Rogers RO4360G2 DK6.15 |
Rogers RO4360 Loss Tangent |
Rogers RO4360G2 PCB |
RO4360G2 High Tg PCB |
RO4000 series PCB |
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