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Rogers RO3035 RF PCB 30mil 0.762mm Laminate 2-layer High Frequency Circuit Board with Low CTE |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Introducing Rogers RO3035 high-frequency circuit materials, engineered from ceramic-filled PTFE composites for commercial microwave and RF applications. Offering remarkable electrical and mechanical stability at competitive prices, these materials ensure consistent mechanical properties. This attribute allows designers to create multi-layer board designs free from warpage and reliability challenges. RO3035 features a coefficient of thermal expansion (CTE) of 17 ppm/°C in the X and Y axes, closely matching copper, which contributes to excellent dimensional stability. Typical etch shrinkage after etching and baking is less than 0.5 mils per inch, while the Z-axis CTE of 24 ppm/°C provides outstanding reliability for plated through-holes, even in severe conditions. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems |
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PCB SIZE |
140 x 52mm=20PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3035 0.762mm |
copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.5 mm / 5.0 mm |
Number of Different Holes: |
11 |
Number of Drill Holes: |
125 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3035 0.762mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±0.1mm |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.5mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3035 (RO3035) |
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RO3035 Typical Value |
Property |
RO3035 |
Direction |
Units |
Condition |
Test Method |
Electrical Properties |
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Dielectric Constant,εProcess |
3.50±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.6 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0015 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-45 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
107 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Thermal Properties |
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Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
17
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Thermal Conductivity |
0.5 |
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W/M/K |
50℃ |
ASTM D 5470 |
Mechanical Properties |
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Copper Peel Stength |
10.2 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Young's Modulus |
1025
1006 |
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MPa |
23℃ |
ASTM D 638 |
Dimensional Stability (MD, CMD) |
-0.11 0.11 |
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mm/m |
Condition A |
IPC TM-650 2.2.4 |
Physical Properties |
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Flammability |
V-0 |
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UL 94 |
Moisture Absorption |
0.04 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Lead-free Process Compatible |
Yes |
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