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2-Layer 25mil 0.635mm Rogers 3006 High Frequency PCB Rogers RO3006 Microwave PCB DK6.15 DF 0.002 |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3006, high - frequency circuit materials, are ceramic - filled PTFE composites meant for commercial microwave and RF applications. They are designed with the aim of providing outstanding electrical and mechanical stability while being competitively priced. The consistency in mechanical properties allows designers to develop multi - layer board designs free from concerns about warpages or reliability glitches. In the X and Y axes, RO3006 materials have a coefficient of thermal expansion (CTE) of 17 ppm/℃. This CTE value matches that of copper, resulting in excellent dimensional stability. Post - etch and bake, the typical etch shrinkage is under 0.5 mils per inch. With a Z - axis CTE of 24 ppm/℃, it offers exceptional plated through - hole reliability, even in extreme environments. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3006 25mil 0.635mm High Frequency PCB DK6.15 RF PCB Board for Power Amplifiers and Antennas |
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PCB SIZE |
70 x 75mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
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RO3006 0.635mm |
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copper ------- 18um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.4mm / 1.0mm |
Number of Different Holes: |
n/a |
Number of Drill Holes: |
n/a |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3006 0.635mm |
Final foil external: |
1 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±0.1mm |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Bottom |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Rogers 3006 (RO3006) Data Sheet |
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RO3006 Typical Value |
Property |
RO3006 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.15±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
6.5 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.002 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-262 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.27
0.15 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1498
1293 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.02 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.86 |
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j/g/k |
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Calculated |
Thermal Conductivity |
0.79 |
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W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
17
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.6 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
7.1 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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