(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Rogers Corporation’s RO4360G2 PCBs are advanced, low-loss materials with a dielectric constant (Dk) of 6.15. These thermoset materials, reinforced with glass and filled with hydrocarbon ceramic, deliver an optimal combination of performance and processability. RO4360G2 laminates are lead-free compatible and provide improved rigidity, simplifying multi-layer board fabrication and reducing overall costs.

Processing similarly to FR-4, RO4360G2 substrates are compatible with automated assembly and feature a low Z-axis CTE for enhanced design flexibility. They share the high Tg characteristic of the RO4000 series and can be used alongside RO4450F prepreg and lower-Dk RO4000 laminates in multi-layer designs.

With a Dk of 6.15 (Design Dk 6.4), RO4360G2 PCBs allow for compact circuit designs, making them ideal for applications where size and cost are critical. They are a cost-effective solution for power amplifiers, patch antennas, ground-based radar, and various RF applications.

1. Optimized Thermoset Resin System for 6.15 Dk:

1). Easy fabrication with processing similar to FR-4.

2). Consistent material performance across batches.

3). Low dielectric loss for superior signal integrity.

4). High thermal conductivity for efficient heat dissipation.

5). Cost-effective solution compared to competing PTFE-based products.

2. Low Z-Axis CTE and High Tg:

1). Enhanced design flexibility.

2). Reliable plated through-hole performance.

3). Compatible with automated assembly processes.

3. Eco-Friendly Design:

1). Supports lead-free manufacturing processes.

4. Regional Inventory Availability:

1). Short lead times and fast inventory turnover.

2). Efficient supply chain management for timely delivery.

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar