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120mil 3.048mm Rogers HF PCB RT/Duroid 6002 DK2.94 With Immersion Gold for Power Backplanes |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RT/duroid 6002 stands out as the first microwave laminate to deliver low loss and low dielectric constant, offering exceptional electrical and mechanical characteristics essential for crafting complex microwave structures that are both reliable and stable. The material's thermal coefficient of dielectric constant is remarkably low across a range of -55℃ to +150℃, which is critical for filter, oscillator, and delay line designers in today’s high-performance applications.
Its low Z-axis coefficient of thermal expansion (CTE) enhances the reliability of plated through holes, having successfully endured over 5,000 temperature cycles (-55℃ to 125℃) without a single failure in vias.
Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficients of expansion to copper, often eliminating the need for double etching for tight positional tolerances. The low tensile modulus (X,Y) minimizes stress on solder joints, allowing laminate expansion to be effectively constrained by minimal low CTE metal (6 ppm/℃), thus improving surface mount reliability.
The unique properties of RT/duroid 6002 make it particularly suitable for applications such as antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits in aerospace designs that must withstand challenging environments. |
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Typical applications: |
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1. Airborne radar systems
2. Beam forming networks
3. Commercial airline collision avoidance
4. Global positioning systems antennas
5. Ground base systems
6. High reliability complex multi-layer circuits
7. Phased array antennas
8. Power backplanes |
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PCB Specifications |
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Rogers RT/Duroid 6002 120mil 3.048mm High Frequency PCB for Power Backplanes |
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PCB SIZE |
95 x 79 mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
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RT/duroid 6002 3.048mm |
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copper ------- 18um(0.5 oz)+plate BOT layer |
TECHNOLOGY |
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Minimum Trace and Space: |
6 mil / 7 mil |
Minimum / Maximum Holes: |
0.4 mm / 5.6 mm |
Number of Different Holes: |
3 |
Number of Drill Holes: |
325 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
1 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RT/duroid 6002 3.048mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
3.1 mm ±0.3 |
PLATING AND COATING |
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Surface Finish |
Immersion gold (37.1% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: |
TOP and Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
TOP and Bottom. |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 6002 (RT/duroid 6002) |
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RT/duroid 6002 Typical Value |
Property |
RT/duroid 6002 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.94±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.94 |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0012 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+12 |
Z |
ppm/℃ |
10 GHz 0℃-100℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
106 |
Z |
Mohm.cm |
A |
ASTM D 257 |
Surface Resistivity |
107 |
Z |
Mohm |
A |
ASTM D 257 |
Tensile Modulus |
828(120) |
X,Y |
MPa(kpsi) |
23℃ |
ASTM D 638 |
Ultimate Stress |
6.9(1.0) |
X,Y |
MPa(kpsi) |
Ultimate Strain |
7.3 |
X,Y |
% |
Compressive Modulus |
2482(360) |
Z |
MPa(kpsi) |
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ASTM D 638 |
Moisture Absorption |
0.02 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1
ASTM D 570 |
Thermal Conductivity |
0.6 |
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W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
16
16
24 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Density |
2.1 |
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gm/cm3 |
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ASTM D 792 |
Specific Heat |
0.93(0.22) |
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j/g/k
(BTU/ib/OF) |
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Calculated |
Copper Peel |
8.9(1.6) |
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Ibs/in.(N/mm) |
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IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Hot Tags:
2-Layer RT/duroid 6002 PCB |
low CTE RT/duroid 6002 Substrate |
low TCDK Material |
RT/duroid 6002 Loss Tangent |
RT/duroid 6002 High Frequency PCB |
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