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Newly Shipped RF PCB |
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The newly shipped PCB column is a collection of our various RF printed circuit boards (PCBs) that have been recently shipped to companies or individuals. In this column, you will find our latest PCB product series, newest technologies, and dynamic market trends. It provides opportunities for individuals or companies to discover new and interesting RF PCB products or technologies that may be useful for their own projects or applications. Hopefully you enjoy it and good luck. |
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| 10OZ-Heavy-Copper-TU-865-Double-Sided-PCB – High-Tg200-and-Exceptional-Moisture-Resistance-0.13 |
| The TU-865 PCB material is a high-performance, halogen-free solution crafted from epoxy resin and E-glass fabric, designed to excel in harsh environments while delivering superior electrical performance and reliability. With a Tg of 200°C, UL94V-0 flammability rating, and 0.13% moisture absorption, it ensures stability in extreme thermal, chemical, and humid conditions. Compatible with AOI processes and featuring UV-blocking properties, TU-865 simplifies manufacturing while offering excellent dimensional stability and CAF resistance. |
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| TU-865 High Frequency PCB |
TU-865 Datasheet |
TU-865 Material |
Double Sided PCB TU-865 |
10OZ TU-865 Thickness |
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| 2-layer-250mil-6.35mm-Thick-Wangling-F4BTMS220-High-Frequency-PCB-with-Low-DF-0.0010-for-Aerospace |
| The F4BTMS series represents a groundbreaking upgrade to the F4BTM series, achieving significant advancements in material formulation and manufacturing processes. Enriched with a high ceramic content and reinforced with ultra-thin, ultra-fine glass fiber cloth, this material delivers superior performance and a wider range of dielectric constants. Designed for high-reliability applications, the F4BTMS series is an ideal choice for aerospace and can seamlessly replace similar foreign products. |
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| Wangling's F4BTMS220 laminates |
2-Layer Low Dissipation PCB |
F4BTMS220 High Speed PCB |
F4BTMS220 Low Moisture Absorption |
250mil F4BTMS220 Thick |
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| 12.9mm-Thick-Wangling-F4BTMS1000-PCB: 4-Layer-Aerospace-Material-with-Enhanced Dielectric-Properties-and-Superior-Thermal-Conductivity |
| As a standard feature, the F4BTMS series includes RTF low roughness copper foil, which reduces conductor loss and delivers exceptional peel strength. Compatible with both copper and aluminum bases, this series offers unparalleled versatility and reliability for demanding applications. Whether for aerospace or other high-performance industries, the F4BTMS series sets a new standard for advanced material technology. |
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| The F4BTMS series High Frequency PCB |
4-Layer Wangling F4BTMS1000 Substrate |
Wangling F4BTMS1000 Price |
Wangling F4BTMS1000 Rigid PCB |
F4BTMS1000 Loss Tangent |
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| 1.6mm-Isola-FR408HR-TG190-4-Layer-PCB-with-Via-in-Pad-and-ENIG: Superior-Performance-and-AOI-Compatibility |
| Crafted with Isola's patented high-performance multifunctional resin system and reinforced with electrical-grade E-glass fabric, FR408HR PCB delivers exceptional thermal and electrical properties. This advanced material system achieves a 30% improvement in Z-axis expansion and provides 25% greater electrical bandwidth (lower loss) compared to competing products, making it ideal for high-speed, high-frequency applications. |
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| FR408HR Dielectric Constant |
Isola FR408HR Prepreg |
Isola FR408HR Datasheet |
FR408HR Material |
Isola FR408HR Density |
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| 1.5mm-HDI-PCB-8-Layer-with-TU-883: Ultra-Low-Loss, High-Speed-Performance-for-RF-and-Wireless-Applications |
| Engineered with a high-performance resin system and reinforced with regular woven E-glass, TU-883 PCB delivers an ultra-low dielectric constant and dissipation factor, making it the ideal choice for high-speed, low-loss designs in radio frequency and wireless applications. This advanced material is fully compatible with lead-free environmental processes and FR-4 manufacturing methods, ensuring seamless integration into your production line. |
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TU-883 PCB Datasheet |
TU-883 High Frequency PCB |
Isola TU-883 PCB Material |
TU-883 1.5mm-HDI-PCB |
TU-883 Low Loss PCB |
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| 10mil-RO4350B-and-S1000-2M-4-Layer-1.6mm-Hybrid-PCB: Low-Cost-RF-Solution-with-Superior-Signal-Integrity |
| Rogers RO4350B PCB is a proprietary woven glass-reinforced hydrocarbon/ceramic material that delivers electrical performance comparable to PTFE/woven glass, combined with the manufacturability of standard epoxy/glass. This unique blend makes it an ideal choice for high-frequency and high-power RF designs. RO4350B laminates offer tight control over dielectric constant (Dk) and low signal loss, while maintaining compatibility with standard epoxy/glass processing methods. |
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RO4350B Datasheet PDF |
RO4350B Dielectric Constant |
4- Layer RO4350B PCB |
RO4350B PCB Material |
Rogers RO4350B Lopro |
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| 16-Layer, 2.0mm-M6-PCB: Optimized-for-5G, HPC, and-High-Speed-Servers-with-Low-Dielectric-Loss-0.002 |
| Panasonic’s Megtron6 (M6) R-5775 is a cutting-edge multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and ultra-reliable electronic applications. Designed to excel in demanding environments, M6 is the material of choice for 5G communications, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). With its industry-leading low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability, M6 ensures superior signal integrity and performance, even in the most challenging high-frequency transmission scenarios. |
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| M6 Laminate for Radar |
Panasonic’s M6 Datasheet |
2.0MM M6 High Frequency PCB |
16-Layer Materials -Megtron6 (M6) R-5775 |
Low Dk 3.4 M6 PCB |
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| SF305-PCB: 0.24mm-Thick, 25um-Polyimide-2-Layer-FPC – Halogen-Free, Flame-Resistant-for-High-Flex-Applications-by-Shengyi |
| Developed by Shengyi Technology, SF305 is a premium adhesive double-sided flexible copper-clad laminate (FCCL) designed for high-reliability flexible electronic devices. Engineered to excel in high-frequency signal transmission and dynamic bending environments, SF305 is the ideal solution for cutting-edge applications such as foldable smartphones, wearable devices, automotive electronics, and medical equipment. |
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SF305 Immersion Gold PCB |
0.24mm-Thick SF305 laminate |
Double Layer Shengyi SF305 PCB |
Shengyi SF305 Price |
Shengyi SF305 SLBK |
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| 4-Layer, 1.6mm-Thick-RO3003-PCB: Advanced-Ceramic-PTFE-Composite-for-5G-mmWave-and-Automotive-Radar-from-Bicheng |
| Rogers RO3003 high-frequency laminates are advanced ceramic-filled PTFE composites engineered for superior performance in commercial microwave and RF applications. With exceptional stability of the dielectric constant (Dk) across a wide range of temperatures and frequencies, RO3003 eliminates the step change in Dk commonly seen near room temperature with traditional PTFE glass materials. |
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| Rogers RO3003 Material |
Rogers RO3003 Datasheet |
4-Layer RO3003 Bondply |
1.6mm RO3003 thickness |
RogersRO3003 Substrate |
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| 25mil-2-Layer-Rogers-RO3210-PCB: Superior-Performance-with-Enhanced-Mechanica-Stability-for-Precision-Applications |
| Rogers' RO3210 high-frequency circuit materials are advanced ceramic-filled laminates reinforced with woven fiberglass, designed to deliver exceptional electrical performance and unmatched mechanical stability. What sets RO3210 apart is its unique combination of surface smoothness, akin to non-woven PTFE laminates for precise line etching, and the rigidity of woven-glass PTFE laminates for enhanced durability. |
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| Rogers RO3210 Td500 °C |
Rogers RO3210 Price |
Rogers RO3210 PCB Core |
Rogers RO3210 Datasheet |
RO3210 High-Frequency PCB |
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| Double-Layer-12mil-Rogers-RO4003C-PCB: Cost-Effective, Low-Loss-Material-for-High-Frequency-and-Multi-Layer-Designs |
| Rogers RO4003C materials are advanced, proprietary laminates combining woven glass reinforcement with hydrocarbon/ ceramic substrates. Designed to deliver the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass, RO4003C substrate offers a unique balance of high-frequency capabilities and cost-effective fabrication. Available in multiple configurations using 1080 and 1674 glass fabric styles, all RO4003C PCBs meet stringent electrical performance specifications. |
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| RO4003C Loss Tangent |
RO4003C Dielectric Constant |
Rogers RO4003C Lopro |
Rogers RO4003C Prepreg |
Rogers RO4003C Datasheet |
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| RT/duroid-6035HTC-2-Layer-20mil-PCB: Ceramic-Filled-PTFE-for-High-Power-RF-and-Microwave-with-Low-Drilling-Costs |
| Rogers RT/duroid 6035HTC high-frequency circuit materials are advanced ceramic-filled PTFE composites, specifically engineered for high-power RF and microwave applications. These laminates deliver exceptional thermal conductivity—nearly 2.4 times higher than standard RT/duroid 6000 series products—making them an ideal choice for demanding high-power designs. |
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| Rogers RT/duroid 6035HTC Datasheet |
Rogers RT/duroid 6035HTC laminate |
RT/duroid 6035HTC PCB |
6035HTC Online Purchase |
6035HTC RF PCB |
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| AL2O3-Ceramic-PCB-1mm-2-Layer-Immersion-Gold-Perfect-for-Spacecraft-Automotive-Electronics-and-Solar-Energy-Systems |
| AL2O3 ceramic laminates are engineered with over 96% aluminum oxide (Al2O3), enhanced by trace elements like yttrium oxide (Y2O3) and magnesium oxide (MgO) for peak performance. With a density of 3.5-3.9 g/cm³ and a hardness exceeding 9 on the Mohs scale, these laminates deliver unmatched durability and wear resistance, rivaling even steel. |
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| Alumina Ceramic AL2O3 Substrate PCB |
Alumina PCB (Al2O3 PCB) |
Aluminum oxide PCB |
Immersion Gold PCB |
2-Layer AL2O3 96% Ceramic PCB |
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