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25mil-2-Layer-Rogers-RO3210-PCB: Superior-Performance-with-Enhanced-Mechanica-Stability-for-Precision-Applications |
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1. Introduction of Rogers RO3210
Rogers' RO3210 high-frequency circuit materials are advanced ceramic-filled laminates reinforced with woven fiberglass, designed to deliver exceptional electrical performance and unmatched mechanical stability. What sets RO3210 apart is its unique combination of surface smoothness, akin to non-woven PTFE laminates for precise line etching, and the rigidity of woven-glass PTFE laminates for enhanced durability.
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These versatile materials are compatible with standard PTFE circuit board fabrication techniques, making them an ideal choice for high-frequency applications requiring superior performance and reliability. Whether you're designing for telecommunications, aerospace, or advanced electronics, RO3210 ensures precision, stability, and consistency in every application. |
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2. Features
- Dk of 10.2 +/- 0.5
- Dissipation factor of .0027 at 10GHz
- Coefficient of thermal expansion matched to copper - x y z : 13 ppm/°C, 13 ppm/°C, 34 ppm/°C
- Decomposition Temperature (Td) of 500 °C TGA
- Thermal Conductivity of 0.81W/mk
- Flammability of V0 UL 94 standard
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3. Benefits
- Woven glass reinforcement
*Improves rigidity for easier handling
- Uniform electrical and mechanical performance;
*Ideal for complex multi-layer high frequency structures
- Low in-plane expansion coefficient (matched to copper)
* Suitable for use with epoxy multi-layer board hybrid designs
* Reliable surface mounted assemblies
- Excellent dimensional stability
* High production yields
-Surface smoothness
* Allows for finer line etching tolerances |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO3210 Core - 0.635 mm (25mil)
Copper_layer_2 - 35 μm
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| 5. PCB Construction Details: |
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| - Board dimensions: 40mm x 44 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.7mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Tin
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 24
Total Pads: 31
Thru Hole Pads: 21
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 22
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure |
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NEXT: Double-Layer-12mil-Rogers-RO4003C-PCB: Cost-Effective, Low-Loss-Material-for-High-Frequency-and Multi-Layer-Designs |
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