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Double Layer 12mil Rogers RO4003C PCB Cost Effective Low Loss Material for High Frequency and Multi Layer Designs |
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1. Introduction of RO4003C Laminate
Rogers RO4003C materials are advanced, proprietary laminates combining woven glass reinforcement with hydrocarbon/ceramic substrates. Designed to deliver the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass, RO4003C substrate offers a unique balance of high-frequency capabilities and cost-effective fabrication.
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Available in multiple configurations using 1080 and 1674 glass fabric styles, all RO4003C PCBs meet stringent electrical performance specifications. They provide exceptional control over dielectric constant (Dk) and low signal loss, while maintaining compatibility with standard epoxy/glass processing methods—all at a fraction of the cost of traditional microwave laminates. Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying production and reducing costs. |
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RO4003C materials are non-brominated and not UL 94 V-0 rated, making them ideal for environmentally conscious designs. Their thermal coefficient of expansion (CTE) is engineered to match copper, ensuring excellent dimensional stability—a critical feature for mixed dielectric multi-layer boards. With a low Z-axis CTE, RO4003C delivers reliable plated through-hole performance, even under severe thermal shock conditions. Additionally, its high glass transition temperature (Tg >280°C / 536°F) ensures stable expansion characteristics across a wide range of processing temperatures. |
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RO4003C PCB is the ideal choice for high-frequency applications, offering unmatched performance, reliability, and cost efficiency for RF, microwave, and multi-layer circuit designs. |
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2. Features
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.
- Thermal Coefficient of dielectric constant of +40 ppm/°C
- Thermal Conductivity 0.71 W/m/°K
- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C
- Low moisture absorption of 0.06%
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3. Benefits
Perfect for Multi-Layer Board (MLB) Designs
Processes Like FR-4 with Reduced Fabrication Costs
Optimized for High-Performance, High-Volume Applications
Competitive Pricing for Superior Value |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.305 mm (12mil)
Copper_layer_2 - 35 μm |
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| 5. PCB Construction Details: |
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| - Board dimensions: 50mm x 70 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.25mm
- No Blind vias.
- Finished board thickness: 0.4mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Electroless Nickle Electroless Palladium Immersion Gold (ENEPIG)
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 17
Total Pads: 54
Thru Hole Pads: 34
Top SMT Pads: 20
Bottom SMT Pads: 0
Vias: 56
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
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NEXT: 4mil 2-Layer Rogers RO4350B PCB Exceptional Thermal Stability and Dimensional Control for Reliable Plated Through Holes |
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