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4mil-2-Layer-Rogers-RO4350B-PCB: Exceptional-Thermal-Stability-and-Dimensional-Control-for-Reliable-Plated-Through-Holes |
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1. Introduction of RO4350B
Rogers RO4350B materials are advanced, proprietary laminates combining woven glass reinforcement with hydrocarbon/ceramic substrates. Designed to deliver electrical performance comparable to PTFE/woven glass and the manufacturability of epoxy/glass, RO4350B offers a unique balance of high-frequency capabilities and cost-effective fabrication.
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RO4350B laminates provide exceptional control over dielectric constant (Dk) and low signal loss, while maintaining compatibility with standard epoxy/glass processing methods—all at a fraction of the cost of traditional microwave laminates. Unlike PTFE-based materials, RO4350B requires no special through-hole treatments or handling procedures, simplifying production and reducing costs. These materials are UL 94 V-0 rated, making them ideal for active devices and high-power RF designs. |
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RO4350B's thermal coefficient of expansion (CTE) is engineered to match copper, ensuring excellent dimensional stability—a critical feature for mixed dielectric multi-layer boards. With a low Z-axis CTE, RO4350B delivers reliable plated through-hole performance, even under severe thermal shock conditions. Additionally, its high glass transition temperature (Tg >280°C / 536°F) ensures stable expansion characteristics across a wide range of processing temperatures. |
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2. Features
- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%
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3. Benefits
Perfect for Multi-Layer Board (MLB) Designs
Processes Like FR-4 with Reduced Fabrication Costs
Exceptional Dimensional Stability for Precision Applications
Competitive Pricing for Superior Value |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_2 - 35 μm |
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| 5. PCB Construction Details: |
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| - Board dimensions: 340 mm x 340 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/5 mils
- Minimum Hole Size: 0.25mm
- No Blind vias.
- Finished board thickness: 0.2mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 16
Total Pads: 60
Thru Hole Pads: 38
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 32
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
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NEXT: RT/duroid-6035HTC-2-Layer-20mil-PCB: Ceramic-Filled-PTFE-for-High-Power-RF-and-Microwave-with-Low-Drilling-Costs |
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