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RT/duroid-6035HTC-2-Layer-20mil-PCB: Ceramic-Filled-PTFE-for-High-Power-RF-and-Microwave-with-Low-Drilling-Costs |
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1. RT/duroid 6035HTC Introduction
Rogers RT/duroid 6035HTC high-frequency circuit materials are advanced ceramic-filled PTFE composites, specifically engineered for high-power RF and microwave applications. These laminates deliver exceptional thermal conductivity—nearly 2.4 times higher than standard RT/duroid 6000 series products—making them an ideal choice for demanding high-power designs.
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Featuring copper foil options (ED and reverse treat) with outstanding long-term thermal stability, RT/duroid 6035HTC ensures reliable performance even in the most challenging environments. Additionally, Rogers' innovative filler system enhances drillability, significantly reducing drilling costs compared to traditional high thermally conductive laminates that rely on alumina fillers. |
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With its superior thermal management, cost-effective manufacturability, and robust performance, RT/duroid 6035HTC is the ultimate solution for high-power RF and microwave applications requiring both efficiency and reliability. |
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2. Key Features of (RT/duroid 6035HTC):
- DK of 3.5 +/- 0.05 at 10 GHz/23°C
- Dissipation factor of 0.0013 at 10 GHz/23°C
- Thermal Coefficient of dielectric constant of -66 ppm/°C
- Moisture Absorption 0.06%
- Thermal Conductivity of 1.44 W/m/K at 80°C
- CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axix of 39ppm/°C
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3. Benefits
- High Thermal conductivity
- Improved dielectric heat dissipation enables lower operating temperatures for high power applications
- Excellent high frequency performance
- Lower insertion loss and excellent thermal stability of traces |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 6035HTC - 0.508 mm (20mil)
Copper_layer_2 - 35 μm |
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| 5. PCB Construction Details: |
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| - Board dimensions: 67.02mm x 45.7 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 14
Total Pads: 41
Thru Hole Pads: 25
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 21
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Aerospace equipment, including space and cabin systems.
- Microwave and RF technologies.
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NEXT: SF490-1-Layer-4mil-Fleixble-PCB: Transparent-PET-with-Immersion-Silver-and-Carbon-Traces-for-Modern-Electronics-by-Shengyi |
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