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Low loss PCB

Low loss PCBs are specifically engineered to minimize signal attenuation and maintain signal integrity in high-frequency applications, making them essential in industries such as telecommunications, aerospace, and medical devices. These PCBs utilize advanced materials with low dissipation factors, typically around 0.001 to 0.002, which significantly reduce energy loss as heat during signal transmission. Additionally, they feature a stable dielectric constant that ensures consistent impedance and signal propagation, thereby minimizing distortion. High thermal conductivity is another critical characteristic, as it facilitates effective heat dissipation, enhancing the reliability and performance of the circuit board. By integrating these features, low loss PCBs provide improved signal integrity and efficiency, making them ideal for modern electronic applications where high-speed data transmission is crucial.

Rogers-RO4360-RF-Circuit-Board-32mil-2-Layer-High-Frequency-PCB-With-Immersion-Gold- for-Power-Amplifiers

RO4360G2 PCBs by Rogers Corporation are high-performance materials with a dielectric constant (Dk) of 6.15, offering low loss and excellent processability. These glass-reinforced, hydrocarbon ceramic-filled thermoset materials are designed to provide a perfect balance of performance and ease of use. RO4360G2 laminates support lead-free processes and offer increased rigidity, improving manufacturability in multi-layer board constructions while lowering material and fabrication costs.

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Rogers RO4360 PCB

Rogers Dural Layer PCB

Double Sided PCB Board

Rogers RO4360G2 RF PCB

Immersion Gold PCB Board

60mil-RO4360G2-High-Frequency-PCB-Rogers-Double-Sided-Radio-Frequency-Circuit-With-Immersion-Gold-for-Ground-based-Radar

Compatible with automated assembly, RO4360G2 high frequency PCBs process like FR-4 and feature a low Z-axis CTE for greater design flexibility. They maintain the high Tg of the RO4000 series and can be paired with RO4450F prepreg and lower-Dk RO4000 laminates for multi-layer designs. With a Dk of 6.15 (Design Dk 6.4), Rogers RO4360G2 PCBs enable smaller circuit designs, making them ideal for applications where space and cost are critical.

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Rogers RO4360G2 PCB

Rogers RO4360G2 laminates

60Mil Rogers RO4360G2 Price

Rogers RO4360G2 Datasheet

Low Z-axis CTE Substrate

Rogers-RT/duroid-6035-PCB-Built-On-Dual-Layer-30mil-Core-With-Immersion-Gold-for-Power-Dividers

Rogers RT/duroid 6035HTC high - frequency circuit materials, which are ceramic - filled PTFE composites, are made for high - power RF and microwave applications. They possess a thermal conductivity that is approximately 2.4 times higher than the standard RT/duroid 6000 products. The copper foil (electrodeposited and reverse - treated) of these laminates shows excellent long - term thermal stability. Therefore, RT/duroid 6035HTC substrates are an ideal choice for high - power applications.

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RT/duroid-6035HTC Datasheet

10mil RT/duroid 6035HTC Thickness

Rogers RT/duroid 6035HTC PCB

RT/duroid 6035HTC Online Purchase

RT/duroid 6035HTC Substrate

60mil-RT/duroid-6035HTC-PCB-on-Double-Sided-Copper-With-Green-Mask-for-High-Power-RF-Amplifiers

Rogers RT/duroid 6035HTC materials are ceramic - filled PTFE composites intended for high - power RF and microwave applications. Their thermal conductivity is almost 2.4 times as much as that of the standard RT/duroid 6000 products. The copper foil (both electrodeposited and reverse - treated) on these laminates has excellent long - term thermal stability. Consequently, RT/duroid 6035HTC PCBs are a top - notch option for high - power applications.

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60mil 6035HTC PCB

RT/duroid 6035HTC substrate

High Frequency PCB Manufacturing

Immersion Gold Surface Finish

Custom PCB

Rogers-4003C-Low-Profile-RF-PCB-20.7mil-RO4003C-LoPro-RTF-with-Gold-for-Low-Noise-Block

RO4003C LoProPCBs make use of a unique Rogers' technology. With this technology, the reverse - treated foil can be bonded to the standard RO4003C dielectric. This leads to a laminate that has low conductor loss, improving insertion loss and signal integrity. Additionally, it maintains all the other beneficial attributes of the standard RO4003C laminate system.

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2 Layers RO4003C LoPro

RO4003C LoPro Rogers PCB

RO4003C LoPro PCB Price

20.7 Mil RO4003C LoPro PCB

Rigid Board ENIG Surface Finish

Rogers-RO4003C-LoPro-PCB-32.7mil-Reverse-Treated-Foil-Circuit-Board-for-Cellular-Base-Station-Antennas

Rogers' proprietary technology is applied in RO4003C LoPro laminates. This technology allows the reverse - treated foil to connect to the standard RO4003C dielectric. Consequently, the laminate has low conductor loss, which helps to enhance insertion loss and ensure signal integrity. All the other desirable properties of the standard RO4003C laminate system are also preserved.

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Rogers 4003C LoPro Material Price

RO4003C LoPro PCB

Rogers LoPro RO4003C PCB

Rogers 4003C Low Profile PCB

Low Profile Printed Circuit Board

Rogers-RO4350B-Low-Profile-RF-Circuit-Board-20.7mil-High-Frequency-PCB-With-Ni/Au-for-Low-Noise-Amplifier

A unique Rogers' technology is employed in RO4350B LoPro laminates. Thanks to this technology, the reverse - treated foil can be bonded to the standard RO4350B dielectric. As a consequence, the laminate has reduced conductor loss, leading to better insertion loss and more reliable signal integrity. Meanwhile, it retains all the other beneficial features of the standard RO4350B laminate system.

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RO4350B LoPro PCB

RO4350B High Frequency PCB

RO4350B RF Circuit Board

20.7mil RO4350B LoPro PCB

Rogers RO4350B Laminate

60mil-Rogers-TC350-PCB-Low-Loss-Circuit-Board-with-Immersion-Gold-for-Thermally-Cycled-Antennas

Rogers TC350 laminate is a composite composed of woven fiberglass reinforcement, ceramic filling, and a PTFE base, being used for printed circuit board fabrication. TC350 PCB is purposely designed to ensure enhanced heat - transfer via its "Best - In - Class" thermal conductivity. Moreover, it is made to reduce dielectric loss and insertion loss. Lower losses, in turn, lead to an elevation in amplifier and antenna gains and an improvement in their efficiencies.

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30mil TC350 PCB Material

TC350 Rogers RF PCB

Rogers Double Sided TC350 PCB

TC350 Rogers PCB

TC350 PCB Immersion Gold

Rogers-TMM10-Microwave-PCB-60mil-1.524mm-Low-CTE-Laminate-with-Immersion-Gold-for-Patch-Antennas

Rogers TMM10 thermoset microwave PCBs are a cutting - edge blend of ceramic, hydrocarbon, and thermoset polymers. Tailored for stripline and microstrip applications where the unwavering reliability of plated - thru - holes is crucial, these PCBs stand out in the market. TMM10 laminates bring together the best of ceramic and traditional PTFE microwave circuit laminates in terms of electrical and mechanical attributes. Notably, they don't demand the specialized manufacturing processes often required by similar materials, offering greater production flexibility.

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Rogers TMM10 Datasheet

60mil TMM10 Substrate

TMM10 High Frequency PCB

Rogers TMM10 PCB

TMM10 Immersion Gold PCB

Rogers-TMM10i-RF-PCB-Double-Layer-75mil-1.905mm-Microwave-Printed-Circuit-Board-With-Pure-Gold-Plated

This microwave printed circuit board (PCB) is constructed using a 75 - mil TMM10i substrate, featuring finished 1 - ounce copper layers. A double - layer design, it lacks both solder mask and silkscreen, providing a clean and unobstructed surface. The pads are plated with 80 micro - inches of pure gold, eliminating the need for an underlying nickel layer. Fabricated to meet IPC Class II standards, TMM10i PCBs are packaged in bundles of 25 for shipping, ensuring consistent quality and reliable delivery.

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75mil TMM10i Thickness

TMM10i Datasheet

TMM10i Rogers RF PCB

Pure Gold Plated TMM10i PCB

TMM10i Printed Circuit Board