| |
|
|
|
|
|
|
|
|
60mil-RT/duroid-6035HTC-PCB-on-Double-Sided-Copper-With-Green-Mask-for-High-Power-RF-Amplifiers |
|
|
(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
|
|
|
|
|
Rogers Corporation's RT/duroid 6035HTC high - frequency circuit materials are ceramic - filled PTFE composites intended for high - power RF and microwave applications. Their thermal conductivity is almost 2.4 times as much as that of the standard RT/duroid 6000 products. The copper foil (both electrodeposited and reverse - treated) on these laminates has excellent long - term thermal stability. Consequently, RT/duroid 6035HTC PCBs are a top - notch option for high - power applications. |
|
|
 |
|
|
|
|
|
Features/Benefits:
1.High Thermal conductivity Improved dielectric heat dissipation enables lower operating temperatures for high power applications
2.Low loss tangent Excellent high frequency performance
3.Thermally stable low profile and reverse treat copper foil Lower insertion loss and excellent thermal stability of traces
4.Advanced filler system Improved drill ability and extended tool life compared to alumina containing circuit materials |
|
|
|
|
|
Typical applications:
1.High Power RF and Microwave Amplifiers
2.Power amplifiers, Couplers, Filters
3.Combiners, Power Dividers |
|
|
|
|
PCB Capability（RT/duroid 6035HTC） |
|
PCB Capability (RT/duroid 6035HTC) |
PCB Material: |
Ceramic-filled PTFE composites |
Designation: |
RT/duroid 6035HTC |
Dielectric constant: |
3.50±0.05 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
|
|
|
|
RT/duroid 6035HTC Data Sheet |
|
Property |
Typical Value RT/duroid 6035HTC |
Direction |
Unit |
Condition |
Test Method |
Dielectric Constant, εr Process |
3.50 ± 0.05 |
Z |
- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, εr
Design |
3.6 |
Z |
- |
8 GHz - 40 GHz |
Differential Phase Length Method |
Dissipation Factor, |
0.0013 |
Z |
- |
10 GHz/23°C |
IPC-TM-650, 2.5.5.5 |
Thermal Coefficient of εr |
-66 |
Z |
ppm/°C |
-50°C to 150°C |
mod IPC-TM-650, 2.5.5.5 |
Dielectric Strength |
835 |
- |
V/Mil |
15 mil thickness |
IPC-TM-650, 2.5.6.2 |
Breakdown Voltage |
12.59 |
- |
kV |
15 mil thickness |
IPC-TM-650, 2.5.6 |
Volume Resistivity |
108 |
- |
MΩ•cm |
COND A |
IPC-TM-650, 2.5.17.1 |
Surface Resistivity |
108 |
- |
MΩ |
COND A |
IPC-TM-650, 2.5.17.1 |
Tensile Modulus |
329
244 |
MD
CMD |
kpsi |
40 hrs @ 23°C/50RH |
ASTM D638 |
Dimensional Stability |
-0.11
-0.08 |
CMD
MD |
mm/m
(mils/inch) |
0.030” 1 oz EDC foil
Thickness
after etch +E4/105 |
IPC-TM-650, 2.4.39A |
Coefficient of Thermal
Expansion (-55 to 288 °C) |
19 |
X |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
|
19 |
Y |
|
|
|
|
39 |
Z |
|
|
|
Thermal Conductivity |
1.44 |
- |
W/m/K |
80°C |
ASTM C518 |
Moisture Absorption |
0.06 |
- |
% |
D24/23 |
IPC-TM-650 2.6.2.1 ASTM D570 |
Density |
2.2 |
- |
gm/cm3 |
23°C |
ASTM D-792 |
Copper Peel Strength |
7.9 |
- |
pli |
20 sec.@ 288°C |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
- |
- |
- |
UL 94 |
Lead-Free Process
Compatible |
YES |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Hot Tags:
60mil 6035HTC PCB |
RT/duroid 6035HTC substrate |
High Frequency PCB Manufacturing |
Immersion Gold Surface Finish |
Custom PCB |
|
|
|
