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Rogers-TMM10-Microwave-PCB-60mil-1.524mm-Low-CTE-Laminate-with-Immersion-Gold-for-Patch-Antennas |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers TMM10 thermoset microwave PCBs are a cutting - edge blend of ceramic, hydrocarbon, and thermoset polymers. Tailored for stripline and microstrip applications where the unwavering reliability of plated - thru - holes is crucial, these PCBs stand out in the market.
TMM10 laminates bring together the best of ceramic and traditional PTFE microwave circuit laminates in terms of electrical and mechanical attributes. Notably, they don't demand the specialized manufacturing processes often required by similar materials, offering greater production flexibility.
These laminates feature an impressively low thermal coefficient of dielectric constant, usually under 30 ppm/°C. The isotropic thermal expansion of TMM10 PCBs, which closely matches that of copper, ensures the creation of highly dependable plated - through holes and reduces etch shrinkage. Moreover, with a thermal conductivity roughly twice that of conventional PTFE/ceramic laminates, they excel at heat dissipation.
Made from thermoset resins, Rogers TMM10 PCBs retain their form when heated. This allows for seamless wire bonding of component leads to circuit traces, eliminating worries about pad detachment or substrate distortion. |
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Typical applications: |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our Capabilities (TMM10 PCB) |
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PCB Capability (TMM10) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10 |
Dielectric constant: |
9.20 ±0.23 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc.. |
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Data Sheet of TMM10 PCB |
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TMM10 Typical Value |
Property |
TMM10 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
9.20±0.23 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
9.8 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0022 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-38 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
285 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
21 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
21 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
13.62 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.79 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.09 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.2 |
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Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.74 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
Rogers TMM10 Datasheet |
60mil TMM10 Substrate |
TMM10 High Frequency PCB |
Rogers TMM10 PCB |
TMM10 Immersion Gold PCB |
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