Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

  Design For Manufacture
 
a Inner Layer
 
b Laminating
 
c Drill
 
d Etching
 
e Outer Layer
 
f Solder Mask
 
f Silkscreen
 
g Carbon Ink
 
pcb Peelable Mask
 
pcb Surface Finish
 
pcb Contour
 
pcb Special Tolerance
   
   
   
   
   

 

 

 

 
Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m2) Middle volume (S<10 m2) Prototype(S<1m2)
48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil
49 Min.height of silkscreen text 35mil 35mil 30mil
50 Min.space from silkscreen to pads 6mil 6mil 5mil
51 Colour of silkscreen White, Black, Yellow
52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
53 Mid distance from carbon ink to pads 12mil 11mil 10mil
54 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mil
55 Min.distance from peelable mask to pads 14mil 13mil 12mil
56 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm
57 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm
58 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um
59 Thickness of Gold of ENIG 0.05-0.1um
60 Thickness of nickel of Gold finger 3-5um
61 Thickness of Gold of Gold finger 0.1-1.27um
62 Thickness of tin of HASL 2.54-6.35um
63 Thickness of OSP 0.2-0.5um
64 Thickness of tin of Immersion tin 0.2-0.75um
65 Thickness of silver of Immersion silver 0.15-0.75um
 
 

 

 

 
 
 
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Address:
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
 
 
 
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86-755-27374946
 
 
 
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