1. Introduction to TLX-9

TLX-9 PCB represents an advanced composite material combining PTFE with precision woven glass reinforcement, delivering exceptional stability in both electrical and mechanical performance. This engineered laminate maintains a tightly controlled dielectric constant of 2.5 across extended frequency ranges and temperature variations, with a remarkably low dissipation factor of 0.0019 at 10 GHz. The material's dimensional stability and near-zero moisture absorption ensure consistent performance throughout fabrication processes, including standard shearing, drilling, milling, and plating operations typical for PTFE/glass composites.

Certified to UL 94 V-0 flammability standards, TLX-9 Laminate meets rigorous safety requirements while retaining the processability advantages of conventional PTFE materials. Its balanced property profile makes it particularly suitable for high-frequency applications where electrical consistency, thermal stability, and flame resistance are critical design considerations. The material's unique composition provides reliable performance in demanding RF and microwave environments without compromising manufacturability.

2. Typical properties

Dielectric Constant @ 10 GHz: 2.5

Dissipation Factor @ 10 GHz: 0.0019

Moisture Absorption: <0.02%

Dielectric Breakdown: >60 kV

Volume Resistivity: 10^7 Mohm/cm

Surface Resistivity: 10^7 Mohm

Arc Resistance: >180 seconds

Flexural Strength Lengthwise: >23,000 lbs./in.

Flexural Strength Crosswise: >19,000 lbs./in.

Peel Strength (1oz copper): 12 lbs./linear in.

Thermal Conductivity: 0.19 W/m/K

x-y CTE (Coefficient of Thermal Expansion): 9-12 ppm/°C

z CTE (Coefficient of Thermal Expansion): 130-145 ppm/°C

UL-94 Flammability Rating: V-0

3. Benefits

- Low Dielectric Constant

- Low Dissipation Factor

- Low Moisture Absorption

- High Dielectric Breakdown

- Good Peel Strength

- Controlled Coefficient of Thermal Expansion (CTE)

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Taconic TLX-9 Core - 0.787 mm (31mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 16

Total Pads: 36

Thru Hole Pads: 25

Top SMT Pads: 11

Bottom SMT Pads: 0

Vias: 23

Nets: 2