1. Introduction of TMM4

TMM4 PCB represents an advanced ceramic-filled hydrocarbon thermoset composite engineered for high-reliability stripline and microstrip applications. This innovative material combines the electrical performance benefits of ceramic substrates with the processability advantages of traditional PTFE laminates, while eliminating the need for specialized manufacturing techniques typically associated with high-frequency materials.

The thermoset polymer matrix delivers exceptional mechanical stability and chemical resistance, ensuring reliable plated-through-hole integrity and wire-bonding performance without pad lifting or substrate deformation. TMM4 Laminate's unique composition provides designers with a robust microwave solution that maintains dimensional stability under thermal stress, making it particularly suitable for demanding RF applications where consistent electrical performance and manufacturing reliability are critical requirements.

2. Features

- Dielectric constant (Dk) of 4.50 +/- .045

- Dissipation factor of .0020 at 10GHz

- Thermal coefficient of Dk of 15ppm/°K

- Coefficient of thermal expansion matched to copper

- Coefficient of Thermal Expansion:  x of 16 ppm/°K, y of 16 ppm/°K, z of 21 ppm/°K

- Decomposition Temperature (Td) of 425 °C TGA

- Thermal Conductivity of 0.7 W/mk

- Moisture absorption of 0.07%-0.18%

- Available in a thickness range of .0015 to .500 inches (+/- .0015”)

3. Benefits

Superior Mechanical Stability – Resists creep and cold flow under thermal and mechanical stress

Chemical Resistance – Withstands harsh process chemicals during fabrication

Thermoset Reliability – Enables robust wire-bonding without pad lifting or substrate deformation

Enhanced PTH Integrity – Ensures high reliability of plated through-holes

Manufacturing Flexibility – Compatible with all standard PCB fabrication processes

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers TMM4 Core - 1.27 mm (50mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 11

Total Pads: 20

Thru Hole Pads: 8

Top SMT Pads: 12

Bottom SMT Pads: 0

Vias: 51

Nets: 2