1. Introduction of RO4350B Core and RO4450F Bondply

Engineered for superior RF performance, Rogers RO4350B laminates combine proprietary ceramic-hydrocarbon technology with woven glass reinforcement to deliver PTFE-grade electrical characteristics while maintaining standard epoxy/glass processability. These innovative materials provide tight dielectric constant (Dk) control and ultra-low signal loss at a fraction of traditional microwave laminate costs, eliminating the need for specialized PTFE handling or through-hole treatments. UL 94 V-0 certified for high-power applications, RO4350B exhibits exceptional thermal stability with copper-matched CTE for reliable multilayer construction and >280°C Tg for extreme environment performance.

The system is further enhanced by RO4450F bondply technology, specifically designed for complex multilayer boards requiring sequential lamination cycles. Its advanced flow characteristics and FR-4 compatibility enable hybrid constructions while maintaining dimensional stability across multiple thermal cycles, making it ideal for next-generation RF designs with demanding fill requirements.

2. Features (RO4350B)

- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C

- Dissipation Factor of 0.0037 at 10GHz/23°C

- Thermal Conductivity of 0.69 W/m/°K

- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C

- High Tg value of >280 °C

- Low water absorption of 0.06%

3. Features (RO4450F)

- Dielectric Constant of DK 3.52 +/-0.05 at 10GHz/23°C

- Dissipation Factor of 0.004 at 10GHz/23°C

- Thermal Conductivity of 0.65 W/m/°K

- X axis CTE of 19 ppm/°C, Y CTE of 17 ppm/°C, Z CTE of 50 ppm/°C

4. PCB Stackup: 18-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO4350B Core - 0.102 mm (4mil)

Copper_layer_2 - 35 μm

-----------4mil RO4450F Bondply -------------

Copper_layer_3 - 35 μm

Rogers RO4350B Core - 0.102 mm (4mil)

Copper_layer_4 - 35 μm

-----------4mil RO4450F Bondply -------------

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Copper_layer_15 - 35 μm

Rogers RO4350B Core - 0.102 mm (4mil)

Copper_layer_16 - 35 μm

-----------4mil RO4450F Bondply -------------

Copper_layer_17 - 35 μm

Rogers RO4350B Core - 0.102 mm (4mil)

Copper_layer_18 - 35 μm

6. PCB Statistics:

Components: 651

Total Pads: 779

Thru Hole Pads: 338

Top SMT Pads: 262

Bottom SMT Pads: 179

Vias: 632

Nets: 12