1. Introduction of F4BM220

Wangling's F4BM220 laminates represent a scientifically engineered PTFE composite solution, combining fiberglass cloth with polytetrafluoroethylene resin and film to deliver superior electrical performance over conventional F4B220 materials. These high-performance laminates feature reduced dielectric loss, enhanced insulation resistance, and improved stability - providing a cost-competitive alternative to imported equivalents.

The series offers two optimized copper foil configurations: F4BM220 with ED copper for standard applications, and F4BME220 featuring reverse-treated foil (RTF) for designs requiring exceptional PIM performance, precision line control, and minimized conductor loss. Through precise adjustment of the PTFE-to-fiberglass ratio, both variants maintain excellent dielectric constant control while delivering industry-leading dimensional stability and thermal performance - with fiberglass content strategically balanced to optimize the thermal expansion coefficient, temperature drift, and loss characteristics.

- Dielectric constant (Dk) of 2.2±0.04 at 10GHz

- Dissipation factor of .001 at 10GHz

- CTE x-axis of 25 ppm/°C, CTE y-axis of 34 ppm/°C, CTE z-axis of 240 ppm/°C, -55°C to 288°C

- Thermal coefficient of Dk at-142 ppm/°C, -55°C to 150°C

- Moisture absorption of ≤0.08%

- Flammability of UL-94 V0

3. PCB Stack-up: 2-layer Rigid PCB

Copper_layer_1 - 35 μm

F4BM220 Core - 1.575 mm

Copper_layer_2 - 35 μm

5. PCB Statistics:

Components: 43
Total Pads: 94
Thru Hole Pads: 56
Top SMT Pads: 38
Bottom SMT Pads: 0
Vias: 51
Nets: 2